公开(公告)号：US20180115336A1

公开(公告)日：2018-04-26

申请号：US15844369

申请日：2017-12-15

Applicant: Apple Inc.

Inventor： Scott A. MYERS ,  Erik L. WANG ,  Jason S. SLOEY

IPC: H04B1/3818 ,  H04M1/02 ,  G06K13/08 ,  H04B1/3816 ,  H05K5/02

CPC classification number: H04B1/3818 ,  G06K13/08 ,  G06K13/0831 ,  H04B1/3816 ,  H04M1/0235 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0283 ,  H04M2250/14 ,  H05K5/0295

Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.