Methods for Bonding Structures With Adhesive in Electronic Devices
    1.
    发明申请
    Methods for Bonding Structures With Adhesive in Electronic Devices 审中-公开
    电子设备中粘合剂结合方法

    公开(公告)号:US20160101609A1

    公开(公告)日:2016-04-14

    申请号:US14538221

    申请日:2014-11-11

    Applicant: Apple Inc.

    Abstract: An electronic device may have display layers and other structures. A layer of liquid adhesive may be patterned onto a structure. The liquid adhesive may be pre-cured to increase the viscosity of the liquid adhesive and to partially shrink the liquid adhesive. The structure to which the liquid adhesive has been applied may be laminated to another structure. During lamination, the pre-cured liquid adhesive may be compressed between the structures that are being laminated. The adhesive may then be fully cured to bond the structures together. The thickening of the liquid adhesive during pre-curing helps control the spread of the adhesive. The shrinking of the liquid adhesive helps prevent stresses from developing that could lead to visible stress-induced artifacts following curing.

    Abstract translation: 电子设备可以具有显示层和其他结构。 液体粘合剂层可以被图案化到结构上。 液体粘合剂可以预固化以增加液体粘合剂的粘度并部分收缩液体粘合剂。 已经施加了液体粘合剂的结构可以层压到另一种结构。 在层压期间,预固化的液体粘合剂可以在被层压的结构之间被压缩。 然后可以将粘合剂完全固化以将结构粘合在一起。 在预固化期间液体粘合剂的增稠有助于控制粘合剂的扩散。 液体粘合剂的收缩有助于防止发生应力,这可能导致固化后可见的应力引起的伪影。

    Touch sensor pattern for edge input detection

    公开(公告)号:US10671222B2

    公开(公告)日:2020-06-02

    申请号:US14870905

    申请日:2015-09-30

    Applicant: Apple Inc.

    Abstract: An apparatus is disclosed. In some examples, the apparatus comprises a cover substrate having a front surface, a first edge and a first cavity adjacent to the first edge. In some examples, the apparatus comprises a plurality of touch sensor electrodes disposed opposite the front surface of the cover substrate. In some examples, the apparatus comprises at least one touch sensor edge electrode disposed within the first cavity on a surface that is angled relative to the front surface of the cover substrate. In some examples, at least one touch sensor edge electrode is disposed on an outward facing curved surface of the first cavity. In some examples, the plurality of touch sensor electrodes are formed from a first conductive material and the at least one touch sensor edge electrode is formed from a second conductive material. In some examples, the first conductive material is transparent, and the second conductive material is non-transparent. In some examples, the second conductive material is formed on a black mask layer disposed around a perimeter of a bottom surface of the cover substrate.

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