公开(公告)号：US20220320174A1

公开(公告)日：2022-10-06

申请号：US17707495

申请日：2022-03-29

Applicant: Apple Inc.

Inventor： Dajiang Yang ,  Hong Wei Lee ,  Xiaofeng Fan ,  Oray O. Cellek ,  Xiangli Li ,  Kai Shen

IPC: H01L27/146 ,  G02B3/00 ,  H04N5/3745 ,  H04N5/353 ,  H04N5/33

Abstract: Disclosed herein are global shutter image sensors and methods of operating such image sensors. An image sensor includes a semiconductor wafer having a light receiving surface opposite an electrical connection surface; an oxide extending from the light receiving surface toward the electrical connection surface and at least partially surrounding a pixel region; a photodiode disposed within the pixel region; and a set of storage nodes disposed under the photodiode, between the photodiode and the electrical connection surface. The set of storage nodes comprises a first storage node and a second storage node. The storage nodes may be disposed vertically beneath the photodiode, or side by side.

公开(公告)号：US12274099B2

公开(公告)日：2025-04-08

申请号：US17707495

申请日：2022-03-29

Applicant: Apple Inc.

Inventor： Dajiang Yang ,  Hong Wei Lee ,  Xiaofeng Fan ,  Oray O. Cellek ,  Xiangli Li ,  Kai Shen

IPC: H01L27/146 ,  G02B3/00 ,  H04N25/20 ,  H04N25/532 ,  H04N25/771 ,  H10F39/00 ,  H10F39/18

Abstract: Disclosed herein are global shutter image sensors and methods of operating such image sensors. An image sensor includes a semiconductor wafer having a light receiving surface opposite an electrical connection surface; an oxide extending from the light receiving surface toward the electrical connection surface and at least partially surrounding a pixel region; a photodiode disposed within the pixel region; and a set of storage nodes disposed under the photodiode, between the photodiode and the electrical connection surface. The set of storage nodes comprises a first storage node and a second storage node. The storage nodes may be disposed vertically beneath the photodiode, or side by side.