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公开(公告)号:US20190248084A1
公开(公告)日:2019-08-15
申请号:US16274856
申请日:2019-02-13
IPC分类号: B29D30/06 , B23K26/352 , B23K26/36
CPC分类号: B29D30/0633 , B23K26/352 , B23K26/36 , B29D2030/0638
摘要: A system for preparing an interior surface of a tire for an adhesive includes a turntable configured to remove a layer of material from the tire, and a manipulator operable to move and rotate the tire. The turntable includes a platform rotatable about a first axis. An ablation module is disposed within the platform and includes one or more lasers each configured to emit a laser beam for removing the layer of material from the tire. A plurality of guide rollers extend from the platform and are operable between a retracted position and an extended position to selectively secure the tire to the platform. An exhaust system is disposed adjacent to the one or more lasers.
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公开(公告)号:US09561805B2
公开(公告)日:2017-02-07
申请号:US14559104
申请日:2014-12-03
IPC分类号: G05B19/18 , B61F1/00 , B61C3/00 , B62D65/18 , B60L3/00 , B60L3/04 , B61F1/08 , B61F5/52 , B60K1/00
CPC分类号: B61C3/00 , B60K2001/001 , B60L3/0007 , B60L3/04 , B60L2200/46 , B60Y2200/62 , B61F1/08 , B61F5/52 , B62D65/18 , G05B19/182 , G05B2219/35165
摘要: A chassis front assembly, a chassis rear assembly and a chassis intermediate assembly are disclosed. The chassis front assembly and the chassis rear assembly are connected to the chassis intermediate assembly for forming a chassis. A kit is also disclosed. A method is also disclosed.
摘要翻译: 公开了一种底盘前部组件,底盘后部组件和底盘中间组件。 底盘前组件和底盘后组件连接到底盘中间组件,用于形成底盘。 还披露了一个套件。 还公开了一种方法。
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公开(公告)号:US20150090149A1
公开(公告)日:2015-04-02
申请号:US14559104
申请日:2014-12-03
CPC分类号: B61C3/00 , B60K2001/001 , B60L3/0007 , B60L3/04 , B60L2200/46 , B60Y2200/62 , B61F1/08 , B61F5/52 , B62D65/18 , G05B19/182 , G05B2219/35165
摘要: A chassis front assembly, a chassis rear assembly and a chassis intermediate assembly are disclosed. The chassis front assembly and the chassis rear assembly are connected to the chassis intermediate assembly for forming a chassis. A kit is also disclosed. A method is also disclosed.
摘要翻译: 公开了一种底盘前部组件,底盘后部组件和底盘中间组件。 底盘前组件和底盘后组件连接到底盘中间组件,用于形成底盘。 还披露了一个套件。 还公开了一种方法。
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