Photonic die alignment
    1.
    发明授权

    公开(公告)号:US11237344B2

    公开(公告)日:2022-02-01

    申请号:US16815655

    申请日:2020-03-11

    IPC分类号: G02B6/42

    摘要: A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.

    MANAGING LASER SYSTEM OPTICAL CHARACTERISTICS

    公开(公告)号:US20240014631A1

    公开(公告)日:2024-01-11

    申请号:US18347907

    申请日:2023-07-06

    摘要: An apparatus comprises an optical cavity formed on a substrate and defining a round-trip optical path, an interface positioning at least a portion of a gain medium to provide an active portion of the round-trip optical path over which the gain medium provides sufficient gain for the optical wave to propagate around the round-trip optical path in a single mode, an output coupler coupling a portion of the optical wave out of the optical cavity from a passive portion of the round-trip optical path into a waveguide segment formed on the substrate, one or more tap couplers each diverting less than 50% of optical power from the waveguide segment, and one or more on-chip modules each receiving diverted optical power from at least one of the tap couplers and providing information associated with a laser that comprises the optical cavity and the gain medium.

    Photonic die alignment
    4.
    发明授权

    公开(公告)号:US11693196B2

    公开(公告)日:2023-07-04

    申请号:US17553904

    申请日:2021-12-17

    IPC分类号: G02B6/42

    摘要: A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.