公开(公告)号：US11837814B2

公开(公告)日：2023-12-05

申请号：US17135753

申请日：2020-12-28

申请人： Amphenol Corporation

发明人： Allan Astbury ,  John Robert Dunham ,  Marc B. Cartier, Jr. ,  Mark W. Gailus ,  Daniel B. Provencher

IPC分类号： H01R13/648 ,  H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H01R12/71 ,  H01R12/73 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/659 ,  H01R43/20 ,  H01R13/6461

CPC分类号： H01R13/514 ,  H01R12/716 ,  H01R12/737 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/6477 ,  H01R13/659 ,  H01R13/6587 ,  H01R43/20 ,  H01R13/6461

摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.

公开(公告)号：US20210257788A1

公开(公告)日：2021-08-19

申请号：US17159855

申请日：2021-01-27

申请人： Amphenol Corporation

发明人： Marc B. Cartier, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  David Levine ,  Allan Astbury ,  Vysakh Sivarajan ,  Daniel B. Provencher ,  Eric Leo

IPC分类号： H01R13/6587 ,  H01R13/6471 ,  H01R12/71 ,  H01R12/51

摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

公开(公告)号：US20210234290A1

公开(公告)日：2021-07-29

申请号：US17159794

申请日：2021-01-27

申请人： Amphenol Corporation

发明人： John Robert Dunham ,  Marc B. Cartier, JR. ,  Mark W. Gailus ,  David Levine ,  Allan Astbury ,  Vysakh Sivarajan ,  Daniel B. Provencher ,  Eric Leo

IPC分类号： H01R12/52 ,  H01R12/58 ,  H01R13/6585

摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

公开(公告)号：US10141676B2

公开(公告)日：2018-11-27

申请号：US15216254

申请日：2016-07-21

申请人： Amphenol Corporation

发明人： Allan Astbury ,  John Robert Dunham ,  Marc B. Cartier, Jr. ,  Mark W. Gailus ,  Daniel B. Provencher

IPC分类号： H01R13/648 ,  H01R13/514 ,  H01R12/71 ,  H01R12/73 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/659 ,  H01R43/20 ,  H01R13/6477 ,  H01R13/6587 ,  H01R13/6461

摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.

公开(公告)号：US11387609B2

公开(公告)日：2022-07-12

申请号：US16897641

申请日：2020-06-10

申请人： Amphenol Corporation

发明人： Daniel B. Provencher ,  Mark W. Gailus ,  David Manter ,  Vysakh Sivarajan

IPC分类号： H01R13/658 ,  H01R13/6587 ,  H01R13/6582 ,  H01R12/72 ,  H01R12/73 ,  H01R13/02 ,  H01R13/518 ,  H01R13/6598 ,  H01R43/24 ,  H01R13/6474

摘要： An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

公开(公告)号：US20200303879A1

公开(公告)日：2020-09-24

申请号：US16897641

申请日：2020-06-10

申请人： Amphenol Corporation

发明人： Daniel B. Provencher ,  Mark W. Gailus ,  David Manter ,  Vysakh Sivarajan

IPC分类号： H01R13/6587 ,  H01R13/6582 ,  H01R12/72 ,  H01R12/73 ,  H01R13/02 ,  H01R13/518 ,  H01R13/6598 ,  H01R43/24

摘要： An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

公开(公告)号：US10720735B2

公开(公告)日：2020-07-21

申请号：US16272075

申请日：2019-02-11

申请人： Amphenol Corporation

发明人： Daniel B. Provencher ,  Mark W. Gailus ,  David Manter ,  Vysakh Sivarajan

IPC分类号： H01R13/658 ,  H01R13/6587 ,  H01R13/6582 ,  H01R12/72 ,  H01R12/73 ,  H01R13/02 ,  H01R13/518 ,  H01R13/6598 ,  H01R43/24 ,  H01R13/6474

摘要： An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

公开(公告)号：US20180109043A1

公开(公告)日：2018-04-19

申请号：US15788602

申请日：2017-10-19

申请人： Amphenol Corporation

发明人： Daniel B. Provencher ,  Mark W. Gailus

IPC分类号： H01R13/6587 ,  H01R12/72 ,  H01R12/73 ,  H01R13/02 ,  H01R13/518 ,  H01R13/6598 ,  H01R43/24

CPC分类号： H01R13/6587 ,  H01R12/724 ,  H01R12/737 ,  H01R13/025 ,  H01R13/518 ,  H01R13/6474 ,  H01R13/6582 ,  H01R13/6598 ,  H01R43/24

摘要： An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

公开(公告)号：US20230420874A1

公开(公告)日：2023-12-28

申请号：US18138535

申请日：2023-04-24

申请人： Amphenol Corporation

发明人： John Robert Dunham ,  Marc B. Cartier, JR. ,  Mark W. Gailus ,  David Levine ,  Allan Astbury ,  Vysakh Sivarajan ,  Daniel B. Provencher ,  Eric Leo

IPC分类号： H01R12/52 ,  H01R12/58 ,  H01R13/6585

CPC分类号： H01R12/52 ,  H01R12/58 ,  H01R13/6585

摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

公开(公告)号：US20230327363A1

公开(公告)日：2023-10-12

申请号：US18208729

申请日：2023-06-12

申请人： Amphenol Corporation

发明人： Allan Astbury ,  John Robert Dunham ,  Marc B. Cartier ,  Mark W. Gailus ,  Daniel B. Provencher

IPC分类号： H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H01R12/71 ,  H01R12/73 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/659 ,  H01R43/20

CPC分类号： H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H01R12/716 ,  H01R12/737 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/659 ,  H01R43/20 ,  H01R13/6461

摘要： A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.