公开(公告)号：US20220115301A1

公开(公告)日：2022-04-14

申请号：US17398600

申请日：2021-08-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Shaun Bowers ,  Yoshio Matsuda ,  Hyung Il Jeon ,  Byong Jin Kim ,  Gi Jeong Kim ,  Jae Min Bae ,  Seung Woo Lee ,  Yong Ho Son ,  Miki Nakashima ,  Kazuaki Nagasawa ,  Shingo Nakamura ,  Sophie Olson ,  Jin Young Khim

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

摘要： In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.