公开(公告)号：US11846446B1

公开(公告)日：2023-12-19

申请号：US17350258

申请日：2021-06-17

Applicant: Amazon Technologies, Inc.

Inventor： Saurabh Kumar Shrivastava ,  Usman Khan ,  Thomas Yun ,  Peter Ross

IPC: F24F6/04 ,  F24F5/00

CPC classification number: F24F6/04 ,  F24F5/0035 ,  F24F2006/046

Abstract: An evaporative cooling module may include a cooling media formed from a vapor permeable membrane in which is formed a plurality of pores at a first side and a second side of the vapor permeable membrane. Individual pores of the plurality of pores may be sized to prevent liquid water from passing there through, and enable water vapor to pass there through. The cooling media may be configured to hold liquid water while an air stream is passed through the cooling media. The evaporative cooling module may also include a module inlet to direct liquid water into the cooling media, a module outlet to direct liquid water out of the cooling media, and a frame configured to support the evaporative cooling module.