公开(公告)号：US10011090B1

公开(公告)日：2018-07-03

申请号：US14318290

申请日：2014-06-27

Applicant: Amazon Technologies, Inc.

Inventor： Chin Siong Khor ,  Robert Zenner ,  Anoop Menon

IPC: B32B7/12 ,  B32B37/14 ,  C03C17/00 ,  B32B17/06

CPC classification number: B32B7/12 ,  B32B17/06 ,  B32B37/12 ,  B32B37/1284 ,  B32B37/14 ,  B32B2457/20 ,  C03C17/00

Abstract: Systems and methods for planar pressing a module are described. A module includes a first layer and a second layer coupled together by an adhesive between the first layer and second layer. The module is disposed on a planar press and the planar press is activated to apply directional pressure and heat to the module for a specified period of time.