公开(公告)号：US09641920B1

公开(公告)日：2017-05-02

申请号：US14502839

申请日：2014-09-30

Applicant: Amazon Technologies, Inc.

Inventor： Alfred Charles Jones, II ,  Kelly Erin Johnson ,  Bhargav Prasad Rajaraman ,  Andrea Cloutier ,  Angel Wilfredo Martinez

IPC: H04R1/02 ,  H04R5/02 ,  H04M1/03

CPC classification number: H04R1/02 ,  H04M1/0264 ,  H04M1/03 ,  H04R1/021 ,  H04R1/025 ,  H04R5/02 ,  H04R2499/11 ,  H04R2499/15

Abstract: Embodiments of the subject technology provides novel approaches to providing structural components for mobile computing devices to meet structural and physical form factor requirements for such devices. More specifically, the subject technology describes examples of novel mid-frame structural components, opposing snap features, camera support housing with an integrated lens, and a flexible printed circuit design with a self aligning dome FPC to button configuration.

公开(公告)号：USD987627S1

公开(公告)日：2023-05-30

申请号：US29809490

申请日：2021-09-28

Applicant: Amazon Technologies, Inc.

Designer： Ippei Matsumoto ,  Manish Avinash Mantrawadi ,  Martin Choe Vogel ,  Kevin Li ,  Andrea Cloutier

Abstract: FIG. 1 is a front perspective view of a wearable device;
FIG. 2 is a back perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left-side view thereof;
FIG. 6 is a right-side view thereof;
FIG. 7 is a front view thereof; and,
FIG. 8 is a back view thereof.
The dashed broken lines depict portions of the wearable device that form no part of the claimed design.