公开(公告)号：US20170263435A1

公开(公告)日：2017-09-14

申请号：US15068160

申请日：2016-03-11

Applicant: Agilent Technologies, Inc.

Inventor： J. Daniel Geist ,  John Calhoun

IPC: H01K1/18 ,  H01K3/06 ,  H01K3/02 ,  H01K1/14 ,  H01K1/04

CPC classification number: H01K1/18 ,  H01J1/15 ,  H01J1/18 ,  H01J3/026 ,  H01K1/04 ,  H01K1/14 ,  H01K3/02 ,  H01K3/06 ,  H05B3/0033 ,  H05B3/16

Abstract: A filament assembly includes a core and a filament. At least a central portion of the filament is disposed on the core. At least the central portion may be straight or may have a high-resistance configuration such as one in which the filament follows a path that changes direction. A thermionically emissive layer may be disposed on the core so as to encapsulate at least the central portion. The filament assembly may be utilized in any application requiring the production of electrons.