公开(公告)号：US11817362B2

公开(公告)日：2023-11-14

申请号：US17374748

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pang Yuan Lee ,  Kuei-Hao Tseng ,  Chih Lung Lin

IPC: H01L23/31 ,  H01L23/528 ,  H01L21/768

CPC classification number: H01L23/3178 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/528 ,  H01L2225/06513 ,  H01L2924/151

Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.