公开(公告)号：US09170631B2

公开(公告)日：2015-10-27

申请号：US13759611

申请日：2013-02-05

Applicant: Advanced Micro Devices, Inc.

Inventor： Samuel Naffziger ,  Bao-min Liu

IPC: G06F1/00 ,  G06F1/32

CPC classification number: G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

Abstract: Methods, apparatus, and fabrication processes relating to thermal calculations of an integrated circuit device are reported. The methods may comprise determining a power consumption by a power entity of an integrated circuit, the power entity comprising at least one functional element of the integrated circuit; determining a temperature of a thermal entity, the thermal entity comprising a subset of the power entity; and adjusting at least one of a voltage or an operating frequency of at least one functional element of the power entity, based upon the temperature of the thermal entity being greater than or equal to a predetermined threshold temperature for the thermal entity.

Abstract translation: 报告了与集成电路装置的热计算相关的方法，装置和制造过程。 所述方法可以包括确定集成电路的功率实体的功率消耗，所述功率实体包括所述集成电路的至少一个功能元件; 确定热实体的温度，所述热实体包括所述功率实体的子集; 以及基于所述热实体的温度大于或等于所述热实体的预定阈值温度来调节所述功率实体的至少一个功能元件的电压或工作频率中的至少一个。