公开(公告)号：US11284511B2

公开(公告)日：2022-03-22

申请号：US16190976

申请日：2018-11-14

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Giordano Di Gregorio ,  Seok Kim (Annie) Tay ,  Karl Wang

IPC分类号： H05K1/18 ,  H05K1/09 ,  H05K3/22 ,  H05K3/06

摘要： A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.

公开(公告)号：US20190174626A1

公开(公告)日：2019-06-06

申请号：US16190976

申请日：2018-11-14

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Giordano Di Gregorio ,  Seok Kim (Annie) Tay ,  Karl Wang

IPC分类号： H05K1/09 ,  H05K3/22 ,  H05K3/06

摘要： A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.