公开(公告)号：US20240314960A1

公开(公告)日：2024-09-19

申请号：US18317936

申请日：2023-05-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Chia Liao ,  Wen-Ting Yu ,  Chin-Chuan Wu ,  Yi-Min Hsu

IPC: H05K7/14 ,  H05K1/14 ,  H05K5/02

CPC classification number: H05K7/1429 ,  H05K1/141 ,  H05K5/0295

Abstract: A circuit board is adapted for inserting an expansion card with an electrical contact part, a non-electrical convex part, and a positioning part. The circuit board includes a board body, a slot, a release structure, and a transmission mechanism. The slot is disposed on the board body and includes a socket, a connecting end, and an outer surface. The socket is adapted for the electrical contact part to be inserted. The release structure is movably disposed at the connecting end and includes a limiting part. The transmission mechanism is disposed in the socket, adjacent to the connecting end, or adjacent to the outer surface. The transmission mechanism includes a driving member and a linking member. The driving member is adapted for contacting the electrical contact part, the non-electrical convex part, or the positioning part. The linking member is disposed between the driving member and the release structure.

公开(公告)号：US20250133649A1

公开(公告)日：2025-04-24

申请号：US18531714

申请日：2023-12-07

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kuan-Chuan Wang ,  Yi-Hong Lin ,  Chin-Chuan Wu ,  Wei-Chia Liao

IPC: H05K1/02 ,  H05K7/20

Abstract: A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The heat dissipation device includes a heat dissipation body and an alignment member extending from the heat dissipation body, and the alignment member is adapted to be detachably connected to the rotating component. When the heat dissipation device is connected to the rotating component through the alignment member, the heat dissipation body is adapted to flip relative to the fixed base along the rotating axis.