公开(公告)号：US20240422956A1

公开(公告)日：2024-12-19

申请号：US18805605

申请日：2024-08-15

Applicant: ASMPT GmbH & Co. KG

Inventor： Karl-Heinz BESCH ,  Thomas BLIEM ,  Thomas ROSSMANN ,  Klaus SATTLER ,  Michele TRIGIANI ,  Markus HUBER

IPC: H05K13/04 ,  H05K13/02 ,  H05K13/08

Abstract: A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.