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公开(公告)号：US20250021017A1
公开(公告)日：2025-01-16
申请号：US18704532
申请日：2022-10-12
Applicant: ASML Netherlands B.V.
Inventor： Raaja Ganapathy SUBRAMANIAN , Bearrach MOEST , Alexander Alexandrovich DANILIN , Rowin MEIJERINK , Tim Izaak Johannes GOOSSEN , Stanislav Markovich SHUMIACHER
IPC: G03F7/00
Abstract: A method of reducing effects of heating and/or cooling a reticle in a lithographic process includes conditioning the reticle to adjust an initial temperature of the reticle to a predetermined temperature, reducing stress in the reticle to reduce parasitic thermal effects, calibrating a reticle heating model by exposing the reticle and a non-production substrate to a dose of radiation, and processing a production substrate by exposing the reticle and a production substrate to a dose of radiation based on the reticle heating model. The method can increase calibration accuracy and speed of the reticle heating model, reduce conditioning times of the reticle, reduce stress in the reticle, avoid rework of production substrates, and increase throughput, yield, and accuracy.
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2.发明公开公开(公告)号：US20240295832A1
公开(公告)日：2024-09-05
申请号：US18573025
申请日：2022-06-13
Applicant: ASML Netherlands B.V. , ASML Holding N.V.
IPC: G03F7/00
CPC classification number: G03F7/70858 , G03F7/70508 , G03F7/70533
Abstract: Embodiments herein describe systems, methods, and devices for thermal conditioning of patterning devices at a litho-graphic apparatus. A patterning device cooling system for thermally conditioning a patterning device (202) of a lithographic apparatus is described, the cooling system including a thermal conditioner that thermally conditions the patterning device, and a controller that controls the thermal conditioner to determine a temperature state of the patterning device, determine a production state of the litho-graphic apparatus, and thermally condition the patterning device for exposures based on the temperature state and a production state of the lithographic apparatus.
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