公开(公告)号：US11416979B2

公开(公告)日：2022-08-16

申请号：US16479190

申请日：2018-01-18

Applicant: ASML Netherlands B.V.

Inventor： Wei Fang ,  Cho Huak Teh ,  Ju Hao Chien ,  Yi-Ying Wang ,  Shih-Tsung Chen ,  Jian-Min Liao ,  Chuan Li ,  Zhaohui Guo ,  Pang-Hsuan Huang ,  Shao-Wei Lai ,  Shih-Tsung Hsu

IPC: G06T7/00

Abstract: A defect displaying method is provided in the disclosure. The method comprises acquiring defect group information from an image of a wafer, wherein the defect group information includes a set of correlations between a plurality of defects identified from the image and one or more corresponding assigned defect types and displaying at least some of the plurality of defects according to their corresponding assigned defect types.