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公开(公告)号：US11996262B2
公开(公告)日：2024-05-28
申请号：US17179165
申请日：2021-02-18
Applicant: ASML Netherlands B.V.
Inventor： Marcus Adrianus Van De Kerkhof , Jing Zhang , Martijn Petrus Christianus Van Heumen , Patriek Adrianus Alphonsus Maria Bruurs , Erheng Wang , Vineet Sharma , Makfir Sefa , Shao-Wei Fu , Simone Maria Scolari , Johannes Andreas Henricus Maria Jacobs
CPC classification number: H01J37/20 , F16L11/04 , F16L11/12 , B01D19/0068 , H01J2237/2001 , H01L21/67288
Abstract: Apparatuses, systems, and methods for transferring fluid to a stage in a charged particle beam system are disclosed. In some embodiments, a stage may be configured to secure a wafer, a chamber may be configured to house the stage; and a tube may be provided within the chamber to transfer fluid between the stage and outside of the chamber. The tube may include a first tubular layer of first material, wherein the first material is a flexible polymer; and a second tubular layer of second material, wherein the second material is configured to reduce permeation of fluid or gas through the tube. In some embodiments, a system may include a degasser system outside of the chamber, where the degasser system may be configured to remove gases from the transfer fluid before the transfer fluid enters the tube.
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公开(公告)号：US12249480B2
公开(公告)日：2025-03-11
申请号：US18643379
申请日：2024-04-23
Applicant: ASML Netherlands B.V.
Inventor： Marcus Adrianus Van De Kerkhof , Jing Zhang , Martijn Petrus Christianus Van Heumen , Patriek Adrianus Alphonsus Maria Bruurs , Erheng Wang , Vineet Sharma , Makfir Sefa , Shao-Wei Fu , Simone Maria Scolari , Johannes Andreas Henricus Maria Jacobs
Abstract: Apparatuses, systems, and methods for transferring fluid to a stage in a charged particle beam system are disclosed. In some embodiments, a stage may be configured to secure a wafer; a chamber may be configured to house the stage; and a tube may be provided within the chamber to transfer fluid between the stage and outside of the chamber. The tube may include a first tubular layer of first material, wherein the first material is a flexible polymer; and a second tubular layer of second material, wherein the second material is configured to reduce permeation of fluid or gas through the tube. In some embodiments, a system may include a degasser system outside of the chamber, where the degasser system may be configured to remove gases from the transfer fluid before the transfer fluid enters the tube.
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公开(公告)号：US11942340B2
公开(公告)日：2024-03-26
申请号：US17811047
申请日：2022-07-06
Applicant: ASML Netherlands B.V.
Inventor： Jeroen Gerard Gosen , Te-Yu Chen , Dennis Herman Caspar Van Banning , Edwin Cornelis Kadijk , Martijn Petrus Christianus Van Heumen , Erheng Wang , Johannes Andreas Henricus Maria Jacobs
CPC classification number: H01L21/67201 , G03F7/70841 , G03F7/70858 , H01L21/67098
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.
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公开(公告)号：US11430678B2
公开(公告)日：2022-08-30
申请号：US16514843
申请日：2019-07-17
Applicant: ASML Netherlands B.V.
Inventor： Jeroen Gerard Gosen , Te-Yu Chen , Dennis Herman Caspar Van Banning , Edwin Cornelis Kadijk , Martijn Petrus Christianus Van Heumen , Erheng Wang , Johannes Andreas Henricus Maria Jacobs
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.
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