公开(公告)号：US11133213B2

公开(公告)日：2021-09-28

申请号：US16674340

申请日：2019-11-05

Applicant: APPLIED Materials, Inc.

Inventor： Dawei Sun ,  Ming Yin

IPC: B32B37/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683

Abstract: A deflectable platen including an annular sidewall, a first layer coupled to the annular sidewall, the first layer having a first temperature control element associated therewith, a second layer coupled to the annular sidewall and disposed in a parallel, spaced-apart relationship with the first layer to define a gap therebetween, the second layer having a second temperature control element associated therewith, and a controller coupled to the first and second temperature control elements and configured to operate the first and second temperature control elements to vary temperatures of the first and second layers relative to one another to deflect the platen to more closely match a contour of a wafer.

公开(公告)号：US11302536B2

公开(公告)日：2022-04-12

申请号：US16657020

申请日：2019-10-18

Applicant: APPLIED Materials, Inc.

Inventor： Ming Yin ,  Dawei Sun

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/20 ,  H01L21/683

Abstract: A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.

公开(公告)号：US20210118692A1

公开(公告)日：2021-04-22

申请号：US16657020

申请日：2019-10-18

Applicant: APPLIED Materials, Inc.

Inventor： Ming Yin ,  Dawei Sun

IPC: H01L21/324 ,  H01L21/20

Abstract: A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.

公开(公告)号：US20210134650A1

公开(公告)日：2021-05-06

申请号：US16674340

申请日：2019-11-05

Applicant: APPLIED Materials, Inc.

Inventor： Dawei Sun ,  Ming Yin

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: A deflectable platen including an annular sidewall, a first layer coupled to the annular sidewall, the first layer having a first temperature control element associated therewith, a second layer coupled to the annular sidewall and disposed in a parallel, spaced-apart relationship with the first layer to define a gap therebetween, the second layer having a second temperature control element associated therewith, and a controller coupled to the first and second temperature control elements and configured to operate the first and second temperature control elements to vary temperatures of the first and second layers relative to one another to deflect the platen to more closely match a contour of a wafer.

公开(公告)号：US20220189784A1

公开(公告)日：2022-06-16

申请号：US17683479

申请日：2022-03-01

Applicant: APPLIED Materials, Inc.

Inventor： Ming Yin ,  Dawei Sun

IPC: H01L21/324 ,  H01L21/20

Abstract: A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.