Device Structures Bonded With Adhesive Films
    1.
    发明申请
    Device Structures Bonded With Adhesive Films 审中-公开
    用粘合膜粘合的器件结构

    公开(公告)号:US20160016395A1

    公开(公告)日:2016-01-21

    申请号:US14805276

    申请日:2015-07-21

    Applicant: APPLE INC.

    Abstract: Adhesive may be used to bond electronic device structures together. The adhesive may be a heat activated film. Heat to activate the film may be produced by vibrating electronic device structures so that they rub against each other. An ohmic heating element may be used to produce heat under the control of circuitry inside an electronic device and may be adjusted based on temperature sensor data. Infrared light may pass through a display cover layer to activate the heat activated film. Radio-frequency signals may heat the heat activated film and may be absorbed by fibers in the film or resonant elements such as metal traces. Exothermic reactions may be used to activate the film. An ultraviolet light source may initiate curing of a solid adhesive film layer before the layer is pressed between structures to be joined. A display may produce light that cures adhesive in an electronic device.

    Abstract translation: 粘合剂可用于将电子器件结构粘合在一起。 粘合剂可以是热活化膜。 可以通过振动电子器件结构使其彼此摩擦来产生热激活膜。 欧姆加热元件可用于在电子设备内的电路控制下产生热量,并且可以基于温度传感器数据进行调整。 红外光可以通过显示器覆盖层以激活热活化膜。 射频信号可以加热热活化膜并且可以被膜中的纤维或诸如金属迹线的谐振元件吸收。 可以使用放热反应来活化膜。 紫外光源可以在层被压接在待连接的结构之前引发固体粘合剂膜层的固化。 显示器可以产生固化电子设备中的粘合剂的光。

    Liquid optically clear adhesive lamination process control
    2.
    发明授权
    Liquid optically clear adhesive lamination process control 有权
    液体光学透明胶粘剂层压工艺控制

    公开(公告)号:US09302457B2

    公开(公告)日:2016-04-05

    申请号:US13766393

    申请日:2013-02-13

    Applicant: Apple Inc.

    Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.

    Abstract translation: 描述了使用液体光学透明粘合剂(LOCA)的方法和装置。 描述了用于检测第一基板和第二基板之间的未固化LOCA的方法。 另外,描述了在第一基板和第二基板之间固化具有LOCA的叠层叠层的改进方法。 该方法包括涉及LOCA可变暴露的预固化方法。 另外,还描述了一种改进的发光二极管(LED)单元组件,用于在预固化过程中将层压叠层暴露于紫外(UV)光。 描述了在预固化过程之前测试LED单元组件的方法。

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