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公开(公告)号：USD1000117S1
公开(公告)日：2023-10-03
申请号：US29784499
申请日：2021-05-19
Applicant: Apple Inc.
Designer： Christina J. Smiechowski , Duy P. Le , Jeffrey Scott Croyle , Matthew Phillip Casebolt , Matthew Vincent Costello , Christopher Wiita , Vijay Karthik Koneru , Robert Boyd , Joseph F. Dembs , Elvin Chu , Guillaume Raoult , Zu-Ning Chen , Christopher Kuh , Robert Brunner
Abstract: FIG. 1 is a top front perspective view of a case with earphones showing the claimed design;
FIG. 2 is a bottom rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The dashed broken lines in the figures show portions of the case with earphones that form no part of the claimed design.-
公开(公告)号：US20230198129A1
公开(公告)日：2023-06-22
申请号：US18109168
申请日：2023-02-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , H04M1/0283 , H04M1/0249 , G06F1/1656 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , B29L2031/34
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：USD980625S1
公开(公告)日：2023-03-14
申请号：US29834044
申请日：2022-04-08
Applicant: Apple Inc.
Designer： Vijay Karthik Koneru , Christopher Wiita , Duy P. Le , Guillaume Raoult , Elvin Chu , Martin Gschwandtl , Christopher Kuh , Robert Brunner
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公开(公告)号：US11581629B2
公开(公告)日：2023-02-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US20220279263A1
公开(公告)日：2022-09-01
申请号：US17223655
申请日：2021-04-06
Applicant: Apple Inc.
Inventor： Duy P. Le , Ryan Ott , Robert A. Boyd , Christina J. Smiechowski , Kjell F. Ekman , Yufan Liao , Wenjie Zhuang
Abstract: A portable listening device comprising: a device housing defining an internal cavity; an acoustic port formed through the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; a multifunction input button coupled to the device housing, the multifunction input button having a distal end and a proximate end, a centerline between the distal and proximate ends and an axis of rotation located between the center line and the proximate end; an electronic circuit disposed within the device housing that requires power to operate and is configured to detect activation of the button; and a battery disposed within the device housing and operable to provide power to the electronic circuit.
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Patent Agency Ranking
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公开(公告)号：USD897320S1
公开(公告)日：2020-09-29
申请号：US29685002
申请日：2019-03-25
Applicant: Apple Inc.
Designer： Robert Boyd , Sean Stewart Corbin , Duy P. Le , Guillaume Raoult , Christopher Kuh , Robert Brunner
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公开(公告)号：US20200099163A1
公开(公告)日：2020-03-26
申请号：US16373539
申请日：2019-04-02
Applicant: Apple Inc.
Inventor： George Tziviskos , Vijay Karthik Koneru , Christopher Wiita , Duy P. Le
Abstract: Structures and methods for connector assemblies and their spring-loaded contacts that can resist corrosion, consume a minimal volume in an electronic device, and are readily manufactured.
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公开(公告)号：US09753490B2
公开(公告)日：2017-09-05
申请号：US14631626
申请日：2015-02-25
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael Benjamin Wittenberg , Sawyer I. Cohen , Benjamin Shane Bustle , Duy P. Le
CPC classification number: G06F1/1613 , G06F1/1626 , G09F13/04 , H04M1/0202 , H04M1/0283 , H05K5/0243
Abstract: An enclosure having an indicium (e.g., logo) and a method for securing an indicium to an enclosure is disclosed. The enclosure includes an aperture extending through an interior portion and an exterior portion of the enclosure. The aperture may include concentric portions. For example, the aperture may include a first opening formed on an interior portion and a second opening smaller than the first opening formed on the exterior portion. The indicium may include a flange member such that the indicium may extend through the first opening but not the second opening. Also, in some embodiments, a plate is adhesively secured to the indicium and the enclosure; however, the indicium is not directly adhesively secured to the enclosure. This may prevent adhesives from protruding from an interface region between the indicium and the enclosure.
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