公开(公告)号：US11720726B1

公开(公告)日：2023-08-08

申请号：US17084367

申请日：2020-10-29

申请人： ANSYS, Inc.

发明人： Cheng-Tang Wu ,  Wei Hu ,  Dandan Lyu ,  Siddharth Shah ,  Ashutosh Srivastava

IPC分类号： G06F30/20 ,  G06F119/02 ,  G06F115/12 ,  G06F111/04 ,  G06F30/25 ,  G06F119/22 ,  G06F30/28 ,  G06F111/00

CPC分类号： G06F30/20 ,  G06F30/25 ,  G06F30/28 ,  G06F2111/00 ,  G06F2111/04 ,  G06F2115/12 ,  G06F2119/02 ,  G06F2119/22

摘要： A global computer aided engineering (CAE) model representing an electronic product that contains solder joints and an individual detailed solder joint model are received. The solder joint model can include a solder ball, one or more metal pads, a portion of printed circuit board, and a portion of semiconductor chip component. The global CAE model includes locations of the solder joints to be evaluated in a drop test simulation. The solder joint model is replicated at each location to create a local CAE model via a geometric relationship between the global CAE model and the local CAE model. Simulated physical behaviors of the product under a design condition are obtained in a co-simulation using the global CAE model in a first time scale and the local CAE model in a second time scale. Simulated physical behaviors are periodically synchronized based on kinematic and force constraints.