公开(公告)号：US20240118131A1

公开(公告)日：2024-04-11

申请号：US18546261

申请日：2022-02-11

Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

Inventor： Johnny Solana Gealon ,  Gharry Maala Bathan ,  Jettro Alcantara Satsatin ,  Chai Wong Lee ,  Johann Philip Trinidad Ignacio

IPC: G01H11/08 ,  B81B7/00

CPC classification number: G01H11/08 ,  B81B7/0032 ,  B81B2201/0285

Abstract: A sensor package is disclosed. The sensor package can include a support structure that is configured to couple with a vibration source by way of a stud. The sensor package can include a cap that is at least partially disposed over the support structure. The cap at least partially defines a cavity. The sensor package can include a vibration sensor module that is coupled to a portion of the support structure and disposed in the cavity. The sensor package can have a mechanical resonant frequency in a range of 0.1 Hz to 11 kHz. The sensor package can include a connector that is coupled to the support structure. The connector can connect to a connection line is electrically connect the vibration sensor module to an external substrate or system. The support structure can include a material that has a Young's modulus of at least 60 GPa and a density less than 3000 kg/m3. The sensor package can include a filler material disposed in the cavity.