公开(公告)号：US20190135614A1

公开(公告)日：2019-05-09

申请号：US16159477

申请日：2018-10-12

Applicant: Analog Devices Global Unlimited Company

Inventor： Oliver J. Kierse ,  Rigan McGeehan ,  Alfonso Berduque ,  Donal Peter McAuliffe ,  Raymond J. Speer ,  Brendan Cawley ,  Brian J. Coffey ,  Gerald Blaney

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/055 ,  H01L23/498 ,  H01L23/24 ,  H01L23/49 ,  H01L23/50 ,  H01L23/00 ,  G01N33/00

Abstract: A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.

公开(公告)号：US10730743B2

公开(公告)日：2020-08-04

申请号：US16159477

申请日：2018-10-12

Applicant: Analog Devices Global Unlimited Company

Inventor： Oliver J. Kierse ,  Rigan McGeehan ,  Alfonso Berduque ,  Donal Peter McAuliffe ,  Raymond J. Speer ,  Brendan Cawley ,  Brian J. Coffey ,  Gerald Blaney

IPC: H01L23/02 ,  B81B7/00 ,  G01N33/00 ,  H01L23/00 ,  H01L23/31 ,  G01N27/404 ,  H01L25/065 ,  B81C1/00 ,  H01L23/055 ,  H01L23/24 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50

Abstract: A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.

公开(公告)号：US20190319011A1

公开(公告)日：2019-10-17

申请号：US16366476

申请日：2019-03-27

Applicant: ANALOG DEVICES GLOBAL UNLIMITED COMPANY

Inventor： Rigan McGeehan ,  Cillian Burke ,  Alan J. O'Donnell

IPC: H01L25/065 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00

Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.