公开(公告)号：US20220192004A1

公开(公告)日：2022-06-16

申请号：US17425713

申请日：2020-01-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jeong-Sang Yu ,  Young-Suk Oh ,  Taek-Min Kim

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46

Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

公开(公告)号：US11785713B2

公开(公告)日：2023-10-10

申请号：US17425713

申请日：2020-01-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jeong-Sang Yu ,  Young-Suk Oh ,  Taek-Min Kim

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0201 ,  H05K3/06 ,  H05K3/4644 ,  H05K1/181 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10189

Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.