公开(公告)号：US20200379527A1

公开(公告)日：2020-12-03

申请号：US16751327

申请日：2020-01-24

Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Hoeseok YANG ,  Beomsik KIM

IPC: G06F1/20 ,  G06F1/3206 ,  G06F1/3234

Abstract: The present disclosure relates to an apparatus and method for improving thermal cycling reliability of a multicore microprocessor, and a method for a method for improving thermal cycling reliability of a multicore microprocessor according to an embodiment of the present disclosure includes determining an optimal temperature of a microprocessor to maximize a mean time to failure of the microprocessor, and increasing at least one of an operating frequency of the microprocessor or a processor utilization of the microprocessor to make a temperature of the microprocessor equal to or higher than the optimal temperature.