公开(公告)号：USD950507S1

公开(公告)日：2022-05-03

申请号：US29732857

申请日：2020-04-28

申请人： AIC INC.

设计人： Yen-Chih Chen ,  Chi-Yuan Hsiao ,  Hsih-Ting You ,  Yu-Hsiang Lin

公开(公告)号：US11096312B1

公开(公告)日：2021-08-17

申请号：US16892804

申请日：2020-06-04

申请人： AIC INC.

发明人： Yen-Chih Chen ,  Chi-Yuan Hsiao ,  Hsih-Ting You ,  Yu-Hsiang Lin

IPC分类号： H05K7/20

摘要： A heat dissipation apparatus includes a heat sink unit, a flow guiding structure and a fan. In addition, the heat sink unit includes a base and a fin set arranged on the base. The flow guiding structure includes an air shield and an engagement frame arranged at one end of the air shield. The air shield includes an enclosure space formed at an internal thereof. The enclosure space includes an opening formed at two ends of the air shield respectively, and the air shield covers an exterior of the fin set with the enclosure space. The engagement frame is selectively arranged at an exterior of any one of the openings of the air shield; and a fan is arranged on the engagement frame.