公开(公告)号：US20220346279A1

公开(公告)日：2022-10-27

申请号：US17236966

申请日：2021-04-21

申请人： AIC INC.

发明人： Yen-Chih CHEN ,  Hsih-Ting YOU ,  Chi-Fu CHEN

IPC分类号： H05K7/20

摘要： A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.

公开(公告)号：US20240102742A1

公开(公告)日：2024-03-28

申请号：US17952286

申请日：2022-09-25

申请人： AIC INC.

发明人： Yen-Chih CHEN ,  Chi-Fu CHEN ,  Wei-Ta CHEN ,  Hung-Hui CHANG

IPC分类号： F28D15/02

CPC分类号： F28D15/0266 ,  F28D15/0275

摘要： A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

公开(公告)号：US20200170145A1

公开(公告)日：2020-05-28

申请号：US16198848

申请日：2018-11-22

申请人： AIC INC.

发明人： Hsih-Ting YOU ,  Yen-Chih CHEN

IPC分类号： H05K7/20 ,  H05K7/14 ,  G11B33/04 ,  G11B33/14

摘要： A hard drive rack ventilation structure includes a primary rack, a plurality of secondary racks and hard drive units. The secondary racks are stacked in layers and assembled inside the primary rack. Each secondary rack includes a top portion and side portions extended downward from two sides thereof, and the two side portions include corresponding sliding tracks thereon. The hard drive units are installed on the sliding tracks of the secondary racks. Each hard drive unit includes a hard drive main body and a handle installed at a front thereof. A gap is formed between the handle and the hard drive main body. A top front edge of each secondary rack includes a hollow portion formed corresponding to the gap of each hard drive unit. The hollow portions and the gaps of the hard drive units are fluidly and vertically connected to form an airflow ventilation channel.

公开(公告)号：US20230280107A1

公开(公告)日：2023-09-07

申请号：US17685329

申请日：2022-03-02

申请人： AIC INC.

发明人： Yen-Chih CHEN ,  Hsih-Ting YOU ,  Chi-Fu CHEN ,  Wei-Ta CHEN ,  Chien-Yang LIN

IPC分类号： F28F3/06 ,  F28D15/02

CPC分类号： F28F3/06 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0029

摘要： A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

公开(公告)号：US20230098311A1

公开(公告)日：2023-03-30

申请号：US17486672

申请日：2021-09-27

申请人： AIC INC.

发明人： Yen-Chih CHEN ,  Hsih-Ting YOU ,  Chi-Fu CHEN

IPC分类号： F28D15/04

摘要： A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.