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公开(公告)号：US12113331B2
公开(公告)日：2024-10-08
申请号：US18210770
申请日：2023-06-16
Applicant: Aeva, Inc.
Inventor： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC: H01S5/0237 , B23K1/005 , B23K101/40 , H01S5/40
CPC classification number: H01S5/0237 , B23K1/0056 , H01S5/4025 , B23K2101/40
Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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2.发明公开公开(公告)号：US20240241237A1
公开(公告)日：2024-07-18
申请号：US18615890
申请日：2024-03-25
Applicant: AEVA, INC.
Inventor： Bing Shen , Kevin Masuda , Brett E. Huff , Pradeep Srinivasan
CPC classification number: G01S7/499 , G01S17/06 , G02B6/1228 , G02B6/126 , G02B27/283 , G02B2006/12138 , G02B2006/1215
Abstract: A polarization splitter-rotator (PSR) is described. The PSR having a silicon nitride based waveguide including a first silicon nitride segment comprising a tapered width in a longitudinal direction and a ridge extending in a transverse direction and an adiabatic coupler coupled with the first silicon nitride segment.
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公开(公告)号：US20220373652A1
公开(公告)日：2022-11-24
申请号：US17882181
申请日：2022-08-05
Applicant: AEVA, INC.
Inventor： Mazin Alalusi , Pradeep Srinivasan , Kevin Masuda
Abstract: A light detection and ranging apparatus (LIDAR) includes at least one waveguide including a first cladding layer having a first refractive index and a second cladding layer having multiple second refractive indexes to expand an optical mode of an optical beam propagating within the waveguide. The second refractive indexes include a gradient of refractive indexes and the first refractive index is less than the second refractive indexes.
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4.发明授权公开(公告)号：US11940572B2
公开(公告)日：2024-03-26
申请号：US17372988
申请日：2021-07-12
Applicant: AEVA, INC.
Inventor： Bing Shen , Kevin Masuda , Brett E. Huff , Pradeep Srinivasan
CPC classification number: G01S7/499 , G01S17/06 , G02B6/1228 , G02B6/126 , G02B27/283 , G02B2006/12138 , G02B2006/1215
Abstract: A polarization splitter-rotator (PSR) is described. The PSR having a silicon nitride based waveguide to split and rotate an optical beam. The silicon nitride based waveguide having a first silicon nitride segment including a first layer and a second layer coupled with the first layer.
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5.发明申请公开(公告)号：US20220196813A1
公开(公告)日：2022-06-23
申请号：US17372988
申请日：2021-07-12
Applicant: AEVA, INC.
Inventor： Bing Shen , Kevin Masuda , Brett E. Huff , Pradeep Srinivasan
Abstract: A polarization splitter-rotator (PSR) is described. The PSR having a silicon nitride based waveguide to split and rotate an optical beam. The silicon nitride based waveguide having a first silicon nitride segment including a first layer and a second layer coupled with the first layer.
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Patent Agency Ranking
公开(公告)号：US20230327395A1
公开(公告)日：2023-10-12
申请号：US18210770
申请日：2023-06-16
Applicant: Aeva, Inc.
Inventor： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC: H01S5/0237 , B23K1/005 , H01S5/40
CPC classification number: H01S5/0237 , B23K1/0056 , H01S5/4025 , B23K2101/40
Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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公开(公告)号：US11362485B1
公开(公告)日：2022-06-14
申请号：US17502941
申请日：2021-10-15
Applicant: Aeva, Inc.
Inventor： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC: H01S5/0237 , B23K1/005 , H01S5/40 , B23K101/40
Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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公开(公告)号：US11715929B2
公开(公告)日：2023-08-01
申请号：US17734506
申请日：2022-05-02
Applicant: Aeva, Inc.
Inventor： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC: H01S5/0237 , H01S5/40 , B23K101/40 , B23K1/005
CPC classification number: H01S5/0237 , B23K1/0056 , H01S5/4025 , B23K2101/40
Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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公开(公告)号：US20230123042A1
公开(公告)日：2023-04-20
申请号：US17734506
申请日：2022-05-02
Applicant: Aeva, Inc.
Inventor： Zhizhong Tang , Pradeep Srinivasan , Kevin Masuda , Wenjing Liang
IPC: H01S5/0237 , B23K1/005 , H01S5/40
Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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公开(公告)号：US11408980B1
公开(公告)日：2022-08-09
申请号：US17545070
申请日：2021-12-08
Applicant: AEVA, INC.
Inventor： Mazin Alalusi , Pradeep Srinivasan , Kevin Masuda
Abstract: A light detection and ranging apparatus (LIDAR) includes an optical source to generate an optical beam and one or more waveguides to steer the optical beam. The one or more waveguides include a first cladding layer having a first refractive index and a second cladding layer disposed below the first cladding layer, the second cladding layer having second refractive indexes including a range of different refractive indexes, wherein the range of different refractive indexes is greater than the first refractive index of the first cladding layer.
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