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公开(公告)号：US11895464B2
公开(公告)日：2024-02-06
申请号：US17880701
申请日：2022-08-04
发明人： Yu Shen , Shiyang Cheng , Yiwei Zhou , Qiang Dan , Yang Li
CPC分类号： H04R19/02 , H04R1/2811 , H04R2201/003 , H04R2499/11
摘要： A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.
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公开(公告)号：US20230217192A1
公开(公告)日：2023-07-06
申请号：US17880701
申请日：2022-08-04
发明人： Yu Shen , Shiyang Cheng , Yiwei Zhou , Qiang Dan , Yang Li
CPC分类号： H04R19/02 , H04R1/2811 , H04R2201/003 , H04R2499/11
摘要： A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.
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