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公开(公告)号：US20200213796A1
公开(公告)日：2020-07-02
申请号：US16708393
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone. The method comprises steps of: preparing a base; forming a first diaphragm on a first surface of the base; preparing a back plate; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm opposite to the first diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes on the second diaphragm; forming a back cavity by etching a second surface of the base opposite to the first surface.
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公开(公告)号：US20200213690A1
公开(公告)日：2020-07-02
申请号：US16708409
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The present invention provides a MEMS microphone, including: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm and a second diaphragm opposite to the back plate and arranged on an upper and lower sides of the back plate. The MEMS microphone further includes an insulation layer isolating the base, the back plate, the first diaphragm and the second diaphragm, and a sealing space formed between the first diaphragm and the second diaphragm. The pressure in the sealing space is equal to an external pressure.
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公开(公告)号：US11405737B2
公开(公告)日：2022-08-02
申请号：US16708427
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.
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公开(公告)号：US11057717B2
公开(公告)日：2021-07-06
申请号：US16708378
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： A MEMS microphone, includes: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate. The first diaphragm and the second diaphragm keeps a distance from the back plate for forming a first insulation gap and a second insulation gap respectively. The back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular. The MEMS microphone further includes a first support piece between the first diaphragm and the second diaphragm through the through holes. Thus, the two diaphragms are not easy to adhere to the back plate.
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公开(公告)号：US11889248B2
公开(公告)日：2024-01-30
申请号：US16708409
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
CPC分类号： H04R1/021 , H04R19/005 , H04R19/016 , H04R2201/003
摘要： The present invention provides a MEMS microphone, including: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm and a second diaphragm opposite to the back plate and arranged on an upper and lower sides of the back plate. The MEMS microphone further includes an insulation layer isolating the base, the back plate, the first diaphragm and the second diaphragm, and a sealing space formed between the first diaphragm and the second diaphragm. The pressure in the sealing space is equal to an external pressure.
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公开(公告)号：US10979825B2
公开(公告)日：2021-04-13
申请号：US16708421
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.
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公开(公告)号：US20200213774A1
公开(公告)日：2020-07-02
申请号：US16708378
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： A MEMS microphone, includes: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate. The first diaphragm and the second diaphragm keeps a distance from the back plate for forming a first insulation gap and a second insulation gap respectively. The back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular. The MEMS microphone further includes a first support piece between the first diaphragm and the second diaphragm through the through holes. Thus, the two diaphragms are not easy to adhere to the back plate.
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公开(公告)号：US10979840B2
公开(公告)日：2021-04-13
申请号：US16708393
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone. The method comprises steps of: preparing a base; forming a first diaphragm on a first surface of the base; preparing a back plate; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm opposite to the first diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes on the second diaphragm; forming a back cavity by etching a second surface of the base opposite to the first surface.
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公开(公告)号：US20200213797A1
公开(公告)日：2020-07-02
申请号：US16708427
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.
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公开(公告)号：US20200213775A1
公开(公告)日：2020-07-02
申请号：US16708421
申请日：2019-12-09
发明人： Zhenkui Meng , Zhengyan Liu
摘要： The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.
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