公开(公告)号：US06604535B2

公开(公告)日：2003-08-12

申请号：US09800156

申请日：2001-03-06

申请人： Yu Lei Shih

发明人： Yu Lei Shih

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： A substrate cleaning apparatus includes a chamber having a substrate support capable of supporting and rotating a substrate in the chamber. A cleaning solution injector is provided to inject a cleaning solution onto the substrate in the chamber. A portion of the cleaning solution is thrown off the rotating substrate to form a cleaning solution mist in the chamber. A cleaning gas inlet introduces a cleaning gas into the chamber and an outlet exhausts the cleaning solution mist and cleaning gas from the chamber. This reduces the formation of residues from the cleaning solution mist on the substrate.