Rotary cutting saw with improved heat dissipation performance
    1.
    发明申请
    Rotary cutting saw with improved heat dissipation performance 有权
    旋转式切割锯具有改善的散热性能

    公开(公告)号:US20050224063A1

    公开(公告)日:2005-10-13

    申请号:US11071302

    申请日:2005-03-04

    CPC classification number: B28D1/121 B23D61/026

    Abstract: A rotary cutting saw including: (a) a base disk which has a plurality of apertures formed therethrough and opening in axially opposite end surfaces thereof; (b) a plurality of abrasive segments which are fixed to an outer circumferential surface of the base disk; and (c) a plurality of axial-runout restraining members which are received in the apertures. Each of the axial-runout restraining members has a size which is smaller than a size of each of the apertures, such that a clearance is defined between the periphery of each of the apertures and a corresponding one of the axial-runout restraining members which is received in the each of the apertures. A ratio of a size of the clearance to the size of each of the axial-runout restraining members is 5-150%.

    Abstract translation: 一种旋转切割锯,包括:(a)基盘,其具有穿过其形成的多个孔,并在其轴向相对的端面中开口; (b)固定在基盘的外周面上的多个研磨片; 和(c)容纳在孔中的多个轴向跳动限制构件。 每个轴向跳动限制构件具有小于每个孔的尺寸的尺寸,使得在每个孔的周边和相应的一个轴向跳动限制构件之间限定间隙,该间隙限制构件是 容纳在每个孔中。 间隙的尺寸与每个轴向跳动限制构件的尺寸的比率为5-150%。

    Rotary cutting saw with improved heat dissipation performance
    2.
    发明授权
    Rotary cutting saw with improved heat dissipation performance 有权
    旋转式切割锯具有改善的散热性能

    公开(公告)号:US07004157B2

    公开(公告)日:2006-02-28

    申请号:US11071302

    申请日:2005-03-04

    CPC classification number: B28D1/121 B23D61/026

    Abstract: A rotary cutting saw including: (a) a base disk which has a plurality of apertures formed therethrough and opening in axially opposite end surfaces thereof; (b) a plurality of abrasive segments which are fixed to an outer circumferential surface of the base disk; and (c) a plurality of axial-runout restraining members which are received in the apertures. Each of the axial-runout restraining members has a size which is smaller than a size of each of the apertures, such that a clearance is defined between the periphery of each of the apertures and a corresponding one of the axial-runout restraining members which is received in the each of the apertures. A ratio of a size of the clearance to the size of each of the axial-runout restraining members is 5–150%.

    Abstract translation: 一种旋转切割锯,包括:(a)基盘,其具有穿过其形成的多个孔,并在其轴向相对的端面中开口; (b)固定在基盘的外周面上的多个研磨片; 和(c)容纳在孔中的多个轴向跳动限制构件。 每个轴向跳动限制构件具有小于每个孔的尺寸的尺寸,使得在每个孔的周边和相应的一个轴向跳动限制构件之间限定间隙,该间隙限制构件是 容纳在每个孔中。 间隙的尺寸与每个轴向跳动限制构件的尺寸的比率为5-150%。

    Diamond cutting saw blades
    3.
    发明授权
    Diamond cutting saw blades 失效
    金刚石切割锯片

    公开(公告)号:US5433187A

    公开(公告)日:1995-07-18

    申请号:US216397

    申请日:1994-03-23

    CPC classification number: B28D1/121

    Abstract: In a diamond cutting saw blade, a plurality of slits 1 are formed at regular intervals on the outer periphery of a disc-shaped iron substrate 2, and a plurality of segment chips 3 are fixed onto the outer periphery of the disc-shaped iron substrate 2. Two trapezoidal concave portions 4 which expand outwardly are formed on both sides of the outer periphery of each segment chip 3. Further, a trapezoidal concave portion 5 is formed at the intermediate position of the segment chip 3 on a joint surface of the iron plate 2 so as to expand toward the joint surface. At the corner where a bottom surface 4a and a tapered surface (side surface) 4b of the concave portion 4 formed on the outer periphery intersect, there is formed a curved surface 4c having a radius of 1.0 to 2.5 mm. Similarly, in a concave portion 5 formed in the inner periphery of the segment chip 3, there is formed a curved surface 5 c having a radius of 1.0 to 2.5 mm at the corner where a bottom surface 5a and a tapered surface (side surface) 5b intersect each other.

    Abstract translation: 在金刚石切割锯片中,在盘状铁基板2的外周上以规则的间隔形成有多个狭缝1,多个片状片3固定在盘状铁基板的外周 在每个分段芯片3的外周两侧形成有两个向外展开的梯形凹部4.此外,在分段芯片3的中间位置,在铁芯的接合面上形成梯形的凹部5 板2朝向接头表面扩张。 在形成在外周上的凹部4的底面4a和锥面(侧面)4b相交的拐角处形成有半径为1.0〜2.5mm的曲面4c。 类似地,在形成在分段芯片3的内周的凹部5中,在底面5a和锥面(侧面)的角部形成半径为1.0〜2.5mm的弯曲面5c, 5b相交。

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