公开(公告)号：US20120211658A1

公开(公告)日：2012-08-23

申请号：US13390057

申请日：2010-05-21

申请人： Carsten Giebeler ,  Neil Conway ,  Tim Chamberlain

发明人： Carsten Giebeler ,  Neil Conway ,  Tim Chamberlain

IPC分类号： G01J5/10 ,  H01L31/18

CPC分类号： G01J5/34 ,  G01J1/46 ,  G01J5/02 ,  G01J5/022 ,  G01J5/024 ,  H01L37/02

摘要： The invention relates to an infrared light detector having a sensor chip (4), which comprises a thin-film element (5) made from a pyroelectrically sensitive material, having an electrical insulator (27), at least one electronic component (17, 18) having a thin-film design, which forms part of a readout electronics unit, and a thin-film membrane (2), on which the sensor chip (4) and the electronic component (17, 18) are mounted side by side in an integrated manner such that the electronic component (17, 18) is electrically conductively coupled to the thin-film element (5). A signal amplifier (22), with which, in co-operation with the electronic component (17, 18), an electrical signal emitted from the sensor chip (4) can be amplified, can be connected to the electronic component (17, 18).

摘要翻译： 本发明涉及一种具有传感器芯片（4）的红外光检测器，其包括由热敏材料制成的薄膜元件（5），其具有电绝缘体（27），至少一个电子元件（17,18） ），其形成读出电子单元的一部分的薄膜设计，以及薄膜膜（2），传感器芯片（4）和电子部件（17,18）并排安装在该薄膜膜上 电子部件（17,18）与薄膜元件（5）导电耦合的集成方式。 与电子部件（17,18）配合可以放大从传感器芯片（4）发射的电信号的信号放大器（22）可以连接到电子部件（17,18） ）。

公开(公告)号：US08963087B2

公开(公告)日：2015-02-24

申请号：US13264908

申请日：2010-04-16

申请人： Carsten Giebeler ,  Jeffrey Wright ,  Tim Chamberlain

发明人： Carsten Giebeler ,  Jeffrey Wright ,  Tim Chamberlain

IPC分类号： G01J5/34 ,  G01J5/08

CPC分类号： G01J5/34 ,  G01J5/08 ,  G01J5/0846

摘要： An infrared light sensor for an infrared light detector (1), including a substrate membrane section (2) and at least two sensor chips (7 to 10), which are fastened next to each other on the substrate membrane section (2) and each comprise a layer element (11) which is produced from pyroelectrically sensitive material and is electrically contacted by a base electrode (12) and a head electrode (13) and is arranged in such that there is a voltage difference in each case between the head electrode (13) and the base electrode (12) of each layer element (11) when the layer elements (11) are irradiated with infrared light; and a coupling line (14 to 16) in each case for two adjacently arranged sensor chips (7 to 10), the coupling line coupling the head electrode (13) of the one sensor chip (7 to 9) and the base electrode (12) of the other sensor chip (8 to 10) to each other in an electrically conductive manner so that the layer elements (11) of the sensor chips (7 to 10) are connected in a series circuit, which has one of the base electrodes (17) at one end thereof and one of the head electrodes (18) at the other end thereof, at which a total voltage difference of the series circuit can be tapped as the sum of the individual voltage differences of the layer elements (11).

摘要翻译： 一种用于红外光检测器（1）的红外光传感器，包括基板膜部分（2）和至少两个传感器芯片（7至10），它们在基板膜部分（2）上彼此紧固并且每个 包括由热敏材料制成并与基底电极（12）和头部电极（13）电接触的层元件（11），并且被布置成使得在每个情况下在头部电极之间存在电压差 （11）被红外线照射时，各层元件（11）的基极（13）和基极（12） 和连接线（14〜16），用于两个相邻布置的传感器芯片（7至10），耦合线将一个传感器芯片（7至9）的头部电极（13）和基极（12） ）以使得传感器芯片（7至10）的层元件（11）连接在串联电路中，该串联电路具有一个基极电极 （17）和其另一端的头电极（18）中的一个，串联电路的总电压差可以抽头作为层元件（11）的各个电压差之和， 。

公开(公告)号：US20120132807A1

公开(公告)日：2012-05-31

申请号：US13264908

申请日：2010-04-16

申请人： Carsten Giebeler ,  Jeffrey Wright ,  Tim Chamberlain

发明人： Carsten Giebeler ,  Jeffrey Wright ,  Tim Chamberlain

IPC分类号： G01J5/10

CPC分类号： G01J5/34 ,  G01J5/08 ,  G01J5/0846

摘要： An infrared light sensor for an infrared light detector (1), including a substrate membrane section (2) and at least two sensor chips (7 to 10), which are fastened next to each other on the substrate membrane section (2) and each comprise a layer element (11) which is produced from pyroelectrically sensitive material and is electrically contacted by a base electrode (12) and a head electrode (13) and is arranged in such that there is a voltage difference in each case between the head electrode (13) and the base electrode (12) of each layer element (11) when the layer elements (11) are irradiated with infrared light; and a coupling line (14 to 16) in each case for two adjacently arranged sensor chips (7 to 10), the coupling line coupling the head electrode (13) of the one sensor chip (7 to 9) and the base electrode (12) of the other sensor chip (8 to 10) to each other in an electrically conductive manner so that the layer elements (11) of the sensor chips (7 to 10) are connected in a series circuit, which has one of the base electrodes (17) at one end thereof and one of the head electrodes (18) at the other end thereof, at which a total voltage difference of the series circuit can be tapped as the sum of the individual voltage differences of the layer elements (11).

摘要翻译： 一种用于红外光检测器（1）的红外光传感器，包括基板膜部分（2）和至少两个传感器芯片（7至10），它们在基板膜部分（2）上彼此紧固并且每个 包括由热敏材料制成并与基底电极（12）和头部电极（13）电接触的层元件（11），并且被布置成使得在每个情况下在头部电极之间存在电压差 （11）被红外线照射时，各层元件（11）的基极（13）和基极（12） 和连接线（14〜16），用于两个相邻布置的传感器芯片（7至10），耦合线将一个传感器芯片（7至9）的头部电极（13）和基极（12） ）以使得传感器芯片（7至10）的层元件（11）连接在串联电路中，该串联电路具有一个基极电极 （17）和其另一端的头电极（18）中的一个，串联电路的总电压差可以抽头作为层元件（11）的各个电压差之和， 。