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公开(公告)号：US20120067525A1
公开(公告)日：2012-03-22
申请号：US13306060
申请日：2011-11-29
CPC分类号： G02F1/1341 , B32B37/0046 , B32B2309/68 , B32B2457/20 , G02F1/1303 , G02F2001/13415
摘要： A substrate bonding apparatus for bonding substrates together in a vacuum at high speeds, with a high degree of accuracy includes a first chamber C1, a second chamber C2, and a third chamber C3. Two substrates to be bonded together are loaded in the first chamber C1. The two substrates are bonded together in the second chamber C2. The two substrates bonded together are unloaded in the third chamber C3. The first and third chambers are variably controlled from an atmospheric pressure state to a medium vacuum state. The second chamber is variably controlled from the medium vacuum state to a high vacuum state.
摘要翻译： 用于在真空中以高速，高精度地将基板接合在一起的基板接合装置包括第一室C1，第二室C2和第三室C3。 要结合在一起的两个基板装载在第一室C1中。 两个基板在第二室C2中结合在一起。 接合在一起的两个基板在第三室C3中被卸载。 第一和第三腔室从大气压力状态可变地控制到中等真空状态。 第二室可从中等真空状态可变地控制到高真空状态。
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公开(公告)号：US07819159B2
公开(公告)日：2010-10-26
申请号：US11439953
申请日：2006-05-25
CPC分类号： G02F1/1341 , G02F1/1303 , G02F2001/133354 , G02F2001/13415 , G02F2202/28
摘要： A bonding apparatus, suitable for accurately bonding large substrates for a liquid crystal display, includes Z-axis drive mechanisms, and upper and lower chambers. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is supported by the upper frame and has an upper table inside. The lower chamber has a lower table inside and is supported on the mount. The upper and lower chambers are united through a seal ring to define a vacuum chamber. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table, and is moved horizontally by a side thrust mechanism disposed outside of the vacuum chamber.
摘要翻译： 适合于将液晶显示器的大基板精确地接合的接合装置包括Z轴驱动机构和上下室。 用于垂直移动上框架的Z轴驱动机构设置在底座的四个角处。 上部腔室由上部框架支撑，内部具有上部工作台。 下腔室内有一个较低的台面，并支撑在支架上。 上部和下部腔室通过密封环联合以限定真空室。 移动上框架使上室垂直移动以打开或关闭真空室。 下表通过多个支撑腿和台之间的自由关节台支撑，并且通过设置在真空室外部的侧推力机构水平移动。
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公开(公告)号：US20080053619A1
公开(公告)日：2008-03-06
申请号：US11877224
申请日：2007-10-23
IPC分类号： B32B37/00
CPC分类号： G02F1/1341 , B32B37/0046 , B32B2309/68 , B32B2457/20 , G02F1/1303 , G02F2001/13415
摘要： A substrate bonding apparatus for bonding substrates together in a vacuum at high speeds, with a high degree of accuracy includes a first chamber C1, a second chamber C2, and a third chamber C3. Two substrates to be bonded together are loaded in the first chamber C1. The two substrates are bonded together in the second chamber C2. The two substrates bonded together are unloaded in the third chamber C3. The first and third chambers are variably controlled from an atmospheric pressure state to a medium vacuum state. The second chamber is variably controlled from the medium vacuum state to a high vacuum state.
摘要翻译： 将基板接合装置以高速高精度高精度地接合在一起的基板接合装置包括第一室C 1，第二室C 2和第三室C 3.将要接合在一起的两个基板装入 第一室C 1。两个基板在第二室C 2中结合在一起。两个粘结在一起的基板被卸载在第三室C 3中。第一和第三室可从大气压状态可变地控制到中等真空 州。 第二室可从中等真空状态可变地控制到高真空状态。
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公开(公告)号：US20070052914A1
公开(公告)日：2007-03-08
申请号：US11439953
申请日：2006-05-25
IPC分类号： G02F1/1339
CPC分类号： G02F1/1341 , G02F1/1303 , G02F2001/133354 , G02F2001/13415 , G02F2202/28
摘要： With substrates to be bonded together becoming larger, there are problems in that a bonding apparatus needs to be built larger to maintain accuracy of products and operation of such a bonding apparatus becomes more complicated. A bonding apparatus includes Z-axis drive mechanisms, an upper chamber, and a lower chamber. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is suspended from the upper frame and has an upper table inside. The lower chamber has a lower table inside. The lower table is supported on the mount via a plurality of support legs. The upper chamber and the lower chamber are united together through a seal ring to define a vacuum chamber. The upper table is coupled to the upper frame and moved by the Z-axis drive mechanisms via the upper frame. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table. Further, the lower table is moved horizontally by a side thrust mechanism disposed on the outside of the vacuum chamber.
摘要翻译： 随着接合的基板变得越来越大，存在的问题是需要将接合装置建立得更大以保持产品的精度，并且这种接合装置的操作变得更加复杂。 接合装置包括Z轴驱动机构，上室和下室。 用于垂直移动上框架的Z轴驱动机构设置在底座的四个角处。 上部室从上部框架悬挂并具有上部工作台。 下室内有一个较低的桌子。 下表通过多个支撑腿支撑在支架上。 上室和下室通过密封环结合在一起以限定真空室。 上表与上框架联接，并通过上框架由Z轴驱动机构移动。 移动上框架使上室垂直移动以打开或关闭真空室。 下表通过多个支撑腿和桌子之间的自由关节台支撑。 此外，下台由设置在真空室外侧的侧推力机构水平移动。
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公开(公告)号：US20070051462A1
公开(公告)日：2007-03-08
申请号：US11513071
申请日：2006-08-31
IPC分类号： B29C65/00
CPC分类号： G02F1/1341 , B32B37/0046 , B32B2309/68 , B32B2457/20 , G02F1/1303 , G02F2001/13415
摘要： A substrate bonding apparatus for bonding substrates together in a vacuum at high speeds, with a high degree of accuracy includes a first chamber C1, a second chamber C2, and a third chamber C3. Two substrates to be bonded together are loaded in the first chamber C1. The two substrates are bonded together in the second chamber C2. The two substrates bonded together are unloaded in the third chamber C3. The first and third chambers are variably controlled from an atmospheric pressure state to a medium vacuum state. The second chamber is variably controlled from the medium vacuum state to a high vacuum state.
摘要翻译： 高精度地在高真空下将基板接合在一起的基板接合装置包括第一室C 1，第二室C 2和第三室C 3。 要结合在一起的两个基板装载在第一室C1中。 两个基板在第二室C 2中结合在一起。 接合在一起的两个基板在第三室C 3中卸载。 第一和第三腔室从大气压力状态可变地控制到中等真空状态。 第二室可从中等真空状态可变地控制到高真空状态。
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6.发明授权公开(公告)号：US06922229B2
公开(公告)日：2005-07-26
申请号：US10387377
申请日：2003-03-14
IPC分类号： G02F1/1341 , G02F1/13
CPC分类号： G02F1/1341 , B32B37/10 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , G02F2001/13415
摘要： One substrate is supported by an attracting and adsorbing operation and by an adhesive means provided inside a pressurizing plate; the other of substrate, on which a liquid crystal agent is dropped, is supported on a table by an attracting and adsorbing operation or by an adhesive means. Then, the pressure inside the chamber is reduced until a designated reduced pressure level is attained, and the pressure is increased after the substrates come firmly into contact with an adhesive agent that has been provided on the other of substrates, so that the individual substrates are attracted and adsorbed by the pressurizing plate and the table, whereby the substrates are laminated while positioning the substrates. Then, by retracting the adhesive means in the pressurizing plate or the table, the adhesive member is removed from the substrate surface, while or after twisting the adhesive member.
摘要翻译： 一个基板通过吸引和吸附操作以及设置在加压板内部的粘合装置来支撑; 通过吸引和吸附操作或通过粘合剂将落在其上的液晶剂的基板中的另一个支撑在工作台上。 然后，减小室内的压力，直到获得指定的减压水平，并且在衬底与设置在另一个衬底上的粘合剂牢固地接触之后压力增加，使得各个衬底 被加压板和工作台吸引并吸附，由此在定位基板的同时层叠基板。 然后，通过缩回加压板或工作台中的粘合剂装置，在将粘合剂部件扭曲或扭曲之后，将粘合部件从基板表面上移除。
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