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公开(公告)号：US08971006B2
公开(公告)日：2015-03-03
申请号：US13362562
申请日：2012-01-31
申请人： Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H01H85/08 , H01H85/10 , H02H5/04 , H05K1/02 , H01H85/046
CPC分类号： H02H5/047 , H01H85/046 , H01H85/08 , H01H85/10 , H05K1/0265 , H05K1/0293 , H05K2201/09263 , H05K2201/09727 , H05K2201/09736 , H05K2201/09781 , H05K2201/0989 , H05K2201/09909 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.
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公开(公告)号：US20120200970A1
公开(公告)日：2012-08-09
申请号：US13362497
申请日：2012-01-31
申请人： Toru ITABASHI , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Toru ITABASHI , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H02H5/04
CPC分类号： H01H37/32 , H01H37/64 , H01H69/022 , H01H85/046 , H05K1/0293 , H05K1/111 , H05K3/3442 , H05K2201/09727 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.
摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装的线，安装在各个部件安装的导线上的多个电子部件，设置在基板上并与每个电子部件耦合的公共线， 连接在组件安装线中的一个和公共线之间的中断线，连接线，中断线通过该连接线与公共线中的一个和部件安装的线中的一个耦合，以及布置在每个之间的焊料 电子部件和相应的部件安装线中的一个并且具有比中断线更低的熔点。 中断线被配置为根据由过电流产生的热量熔化，以便中断一个部件安装的线和公共线之间的耦合。
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公开(公告)号：US08773833B2
公开(公告)日：2014-07-08
申请号：US13362497
申请日：2012-01-31
申请人： Toru Itabashi , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Toru Itabashi , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H02H5/04
CPC分类号： H01H37/32 , H01H37/64 , H01H69/022 , H01H85/046 , H05K1/0293 , H05K1/111 , H05K3/3442 , H05K2201/09727 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.
摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装的线，安装在各个部件安装的导线上的多个电子部件，设置在基板上并与每个电子部件耦合的公共线， 连接在组件安装线中的一个和公共线之间的中断线，连接线，中断线通过该连接线与公共线中的一个和部件安装的线中的一个耦合，以及布置在每个之间的焊料 电子部件和相应的部件安装线中的一个并且具有比中断线更低的熔点。 中断线被配置为根据由过电流产生的热量熔化，以便中断一个部件安装的线和公共线之间的耦合。
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公开(公告)号：US20120200974A1
公开(公告)日：2012-08-09
申请号：US13362562
申请日：2012-01-31
申请人： Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
CPC分类号： H02H5/047 , H01H85/046 , H01H85/08 , H01H85/10 , H05K1/0265 , H05K1/0293 , H05K2201/09263 , H05K2201/09727 , H05K2201/09736 , H05K2201/09781 , H05K2201/0989 , H05K2201/09909 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.
摘要翻译： 电子控制装置包括基板，多个部件安装导线，多个电子部件，公共线，中断线和保护层。 组件安装线和公共线设置在基板上。 电子部件安装在相应的部件安装的导线上并与公共线耦合。 中断线耦合在一个部件安装的线和公共线之间，并且被配置为根据由过电流产生的热量熔化，以中断部件安装的线和公共线之间的耦合。 保护层覆盖包括中断线的基板的表面，并且限定开口部分，使得中断线的至少一部分被暴露。
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公开(公告)号：US20120201010A1
公开(公告)日：2012-08-09
申请号：US13362295
申请日：2012-01-31
IPC分类号： H05K7/00
CPC分类号： H01H85/0241 , H01H23/10 , H01H23/105 , H01H85/046 , H01H2085/0275 , H01H2085/0414
摘要： An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.
摘要翻译： 电子控制装置包括一个或多个基板，壳体，多个电路块，公共线，多个分支线和两个中断线。 电路块设置在基板上，并且基板设置在壳体中。 公共电线由电路块共享。 分支线分别耦合在电路块和公共线之间。 两个中断线分别与两条公共线和分支线耦合，用于电路块的过流保护。
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公开(公告)号：US20120200972A1
公开(公告)日：2012-08-09
申请号：US13362251
申请日：2012-01-31
申请人： Takahiko FURUTA , Toru Itabashi , Yuuki Mikami , Naoki Tanimoto , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Takahiko FURUTA , Toru Itabashi , Yuuki Mikami , Naoki Tanimoto , Hiroaki Nakamura , Shigeki Nishiyama
CPC分类号： H05K1/0293 , H01H85/046 , H05K1/0206 , H05K1/0209 , H05K1/0265 , H05K2201/09727 , H05K2201/09772 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.
摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装导线，安装在各个部件安装导线上的多个电子部件，与每个电子部件连接的公共线，连接在 部件安装线和公共线之一以及放热部。 中断线根据过电流产生的热量而熔化。 散热部分附接到公共导线，并且设置在与中断线的布线距离短于中断线和任何电子部件之间的布线距离的位置，除了安装在其上的电子部件之一 其中一个组件安装的电线。
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公开(公告)号：US09148948B2
公开(公告)日：2015-09-29
申请号：US13362327
申请日：2012-01-31
申请人： Ryoichi Shiraishi , Toru Itabashi , Takahiko Furuta , Yuuki Mikami , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Ryoichi Shiraishi , Toru Itabashi , Takahiko Furuta , Yuuki Mikami , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H02H5/04 , H05K1/02 , H01H85/046
CPC分类号： H05K1/0265 , H01H85/046 , H05K1/0293 , H05K2201/09263 , H05K2201/09727 , H05K2201/09772 , H05K2201/10181
摘要： An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.
摘要翻译： 电子控制装置包括基板，设置在基板上的部件安装的导线，安装在相应的部件安装导线上的电子部件，设置在基板上并与每个电子部件耦合的公共线，以及连接在 组件安装线和公共线之一。 中断线根据过电流产生的热量而熔化。 中断线包括第一线段和比第一线段短的第二线段。 第一线段和第二线段以预定角度相互耦合，该预定角度被确定为使得线段中的一个与公共线耦合，而另一个与部件安装线中的一个耦合。
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公开(公告)号：US08971003B2
公开(公告)日：2015-03-03
申请号：US13362295
申请日：2012-01-31
IPC分类号： H01H85/046 , H01H85/02 , H01H85/041 , H01H23/10
CPC分类号： H01H85/0241 , H01H23/10 , H01H23/105 , H01H85/046 , H01H2085/0275 , H01H2085/0414
摘要： An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.
摘要翻译： 电子控制装置包括一个或多个基板，壳体，多个电路块，公共线，多个分支线和两个中断线。 电路块设置在基板上，并且基板设置在壳体中。 公共电线由电路块共享。 分支线分别耦合在电路块和公共线之间。 两个中断线分别与两条公共线和分支线耦合，用于电路块的过流保护。
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公开(公告)号：US08780518B2
公开(公告)日：2014-07-15
申请号：US13362251
申请日：2012-01-31
申请人： Takahiko Furuta , Toru Itabashi , Yuuki Mikami , Naoki Tanimoto , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Takahiko Furuta , Toru Itabashi , Yuuki Mikami , Naoki Tanimoto , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H02H5/00
CPC分类号： H05K1/0293 , H01H85/046 , H05K1/0206 , H05K1/0209 , H05K1/0265 , H05K2201/09727 , H05K2201/09772 , H05K2201/10181
摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.
摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装导线，安装在各个部件安装导线上的多个电子部件，与每个电子部件连接的公共线，连接在 部件安装线和公共线之一以及放热部。 中断线根据过电流产生的热量而熔化。 散热部分附接到公共导线，并且设置在与中断线的布线距离短于中断线和任何电子部件之间的布线距离的位置，除了安装在其上的电子部件之一 其中一个组件安装的电线。
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公开(公告)号：US20120200973A1
公开(公告)日：2012-08-09
申请号：US13362327
申请日：2012-01-31
申请人： Ryoichi SHIRAISHI , Toru Itabashi , Takahiko Furuta , Yuuki Mikami , Hiroaki Nakamura , Shigeki Nishiyama
发明人： Ryoichi SHIRAISHI , Toru Itabashi , Takahiko Furuta , Yuuki Mikami , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号： H02H5/04
CPC分类号： H05K1/0265 , H01H85/046 , H05K1/0293 , H05K2201/09263 , H05K2201/09727 , H05K2201/09772 , H05K2201/10181
摘要： An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.
摘要翻译： 电子控制装置包括基板，设置在基板上的部件安装的导线，安装在相应的部件安装导线上的电子部件，设置在基板上并与每个电子部件耦合的公共线，以及连接在 组件安装线和公共线之一。 中断线根据过电流产生的热量而熔化。 中断线包括第一线段和比第一线段短的第二线段。 第一线段和第二线段以预定角度相互耦合，该预定角度被确定为使得线段中的一个与公共线耦合，而另一个与部件安装线中的一个耦合。
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