公开(公告)号：US06401554B1

公开(公告)日：2002-06-11

申请号：US09869536

申请日：2001-06-29

申请人： Kunihiko Mori ,  Taizo Ishikura

发明人： Kunihiko Mori ,  Taizo Ishikura

IPC分类号： G01N1900

CPC分类号： H01L21/67288 ,  H01L21/68 ,  H01L21/681

摘要： An inspection apparatus for inspecting the soundness of a substrate transfer robot of a type horizontally transferring a substrate such as a semiconductor wafer mounted on a blade. The inspection apparatus is efficiently used in a multi-chamber type semiconductor manufacturing apparatus and has a noncontact type distance sensor capable of measuring a vertical distance. When the upper face of a cassette stage disposed within a load-lock chamber is assumed to be a reference surface, the distance sensor in the inspection apparatus measures the vertical distance between the horizontal reference surface and the blade of robot moving above the reference surface. From thus measured value, the warp of blade and its shaking upon movement can be detected.

摘要翻译： 一种用于检查水平传送诸如安装在刀片上的半导体晶片的衬底的类型的衬底传送机器人的良好性的检查装置。 检查装置有效地用于多室型半导体制造装置中，并具有能够测量垂直距离的非接触型距离传感器。 当设置在装载锁定室内的盒式台的上表面被认为是基准面时，检查装置中的距离传感器测量在基准面上方的水平参考面和机器人的叶片之间的垂直距离。 从这样测量的值，可以检测到叶片的翘曲及其在移动时的振动。