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公开(公告)号：US20160011514A1
公开(公告)日：2016-01-14
申请号：US14770979
申请日：2014-02-26
发明人： Kazunori TSUGE , Yoshihito TANAKA , Koji AKIYAMA , Kiyoshi TANAKA , Kazuyoshi NISHIO , Takehiro KATO , Masaru MURAKAMI , Tadayoshi SAITO , Hirotoshi YOSHIMURA , Akira INOUE , Iwao NUMAKURA , Noriaki TSUKADA
CPC分类号： G03F7/2002 , G03C1/76 , G03C1/95 , G03F1/50 , G03F7/0012 , G03F7/004 , G03F7/038 , G03F7/09 , G03F7/11 , G03F7/2016 , G03F7/2022 , G03F7/203 , G03F7/32 , G03F7/40 , H01L23/49894 , H01L2924/0002 , H05K1/0269 , H05K3/287 , H05K3/341 , H05K2201/099 , H05K2201/09936 , H05K2203/056 , H05K2203/0571 , H01L2924/00
摘要： A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.
摘要翻译： 制造基板的方法包括在基体的至少一个表面上涂覆含有环氧类树脂和丙烯酸类树脂的混合树脂的阻焊油墨，以形成阻焊层，并且将阻焊剂的预定部分照射 并且控制照射到预定阻焊层的紫外线的照射量，以形成透射光的透射率的预定部分。
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公开(公告)号：US09857687B2
公开(公告)日：2018-01-02
申请号：US14770979
申请日：2014-02-26
发明人： Kazunori Tsuge , Yoshihito Tanaka , Koji Akiyama , Kiyoshi Tanaka , Kazuyoshi Nishio , Takehiro Kato , Masaru Murakami , Tadayoshi Saito , Hirotoshi Yoshimura , Akira Inoue , Iwao Numakura , Noriaki Tsukada
IPC分类号： G03F7/004 , G03F7/09 , G03C1/76 , G03C1/95 , G03F7/20 , G03F7/11 , H01L23/498 , H05K1/02 , H05K3/28 , G03F1/50 , G03F7/32 , G03F7/40 , H05K3/34
CPC分类号： G03F7/2002 , G03C1/76 , G03C1/95 , G03F1/50 , G03F7/0012 , G03F7/004 , G03F7/038 , G03F7/09 , G03F7/11 , G03F7/2016 , G03F7/2022 , G03F7/203 , G03F7/32 , G03F7/40 , H01L23/49894 , H01L2924/0002 , H05K1/0269 , H05K3/287 , H05K3/341 , H05K2201/099 , H05K2201/09936 , H05K2203/056 , H05K2203/0571 , H01L2924/00
摘要： A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.
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