公开(公告)号：US20090191666A1

公开(公告)日：2009-07-30

申请号：US12349816

申请日：2009-01-07

申请人： Souu Kumagai

发明人： Souu Kumagai

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips formed on the face side of a wafer, on the face side of the wafer along planned dividing lines; stacking existing second chips on the first chips; covering the face-side surfaces of the second chips with a protective member; and grinding the back side of the wafer until the dividing grooves are exposed and the first chips are thinned to the finished thickness, to obtain semiconductor devices of a two-layer structure.

摘要翻译： 一种层叠型半导体器件的制造方法，包括以下步骤：在晶片的表面上形成具有对应于形成在晶片表面侧的多个第一芯片的成品厚度的深度的分割槽 沿计划分界线; 在第一个芯片上堆叠现有的第二个芯片; 用保护构件覆盖第二芯片的表面侧表面; 并且研磨晶片的背面，直到分隔槽露出，并将第一芯片变薄到最终厚度，以获得两层结构的半导体器件。

公开(公告)号：US20080306432A1

公开(公告)日：2008-12-11

申请号：US12123322

申请日：2008-05-19

申请人： Souu Kumagai ,  Fumiteru Tashino

发明人： Souu Kumagai ,  Fumiteru Tashino

IPC分类号： A61B17/32

CPC分类号： B28D5/022 ,  B27B5/32 ,  H01L21/67092 ,  Y10S83/956 ,  Y10T83/9379 ,  Y10T83/9403 ,  Y10T83/97

摘要： A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.

摘要翻译： 切割装置包括支撑用于向切割刀片施加超声波振动的第一超声换能器的刀片安装件。 叶片安装件包括一个环形凸缘，该环形凸缘在其外圆周侧表面上具有用于夹持切割刀片的抓握表面，用于容纳第一超声波换能器的第一超声波换能器容纳部分和一个中空圆柱形安装凸台， 主轴。 环形凸缘在第一超声波换能器壳体部分和安装凸台之间具有限定在其中的多个通孔。 刀片抓握凸缘具有安装在安装凸台上的嵌合孔，用于夹持切割刀片的外周侧表面上的抓握表面，用于容纳第二超声波换能器的第二超声波换能器容纳部分和限定的多个通孔 在第二超声波换能器容纳部和配合孔之间。

公开(公告)号：US07982279B2

公开(公告)日：2011-07-19

申请号：US12349816

申请日：2009-01-07

申请人： Souu Kumagai

发明人： Souu Kumagai

IPC分类号： H01L21/76 ,  H01L21/70 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips formed on the face side of a wafer, on the face side of the wafer along planned dividing lines; stacking existing second chips on the first chips; covering the face-side surfaces of the second chips with a protective member; and grinding the back side of the wafer until the dividing grooves are exposed and the first chips are thinned to the finished thickness, to obtain semiconductor devices of a two-layer structure.

摘要翻译： 一种层叠型半导体器件的制造方法，包括以下步骤：在晶片的表面上形成具有对应于形成在晶片表面侧的多个第一芯片的成品厚度的深度的分割槽 沿计划分界线; 在第一个芯片上堆叠现有的第二个芯片; 用保护构件覆盖第二芯片的表面侧表面; 并且研磨晶片的背面，直到分隔槽露出，并将第一芯片变薄到最终厚度，以获得两层结构的半导体器件。

公开(公告)号：US07563155B2

公开(公告)日：2009-07-21

申请号：US12123322

申请日：2008-05-19

申请人： Souu Kumagai ,  Fumiteru Tashino

发明人： Souu Kumagai ,  Fumiteru Tashino

IPC分类号： B24B9/00

CPC分类号： B28D5/022 ,  B27B5/32 ,  H01L21/67092 ,  Y10S83/956 ,  Y10T83/9379 ,  Y10T83/9403 ,  Y10T83/97

摘要： A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.

摘要翻译： 切割装置包括支撑用于向切割刀片施加超声波振动的第一超声换能器的刀片安装件。 叶片安装件包括一个环形凸缘，该环形凸缘在其外圆周侧表面上具有用于夹持切割刀片的抓握表面，用于容纳第一超声波换能器的第一超声波换能器容纳部分和一个中空圆柱形安装凸台， 主轴。 环形凸缘在第一超声波换能器壳体部分和安装凸台之间具有限定在其中的多个通孔。 刀片抓握凸缘具有安装在安装凸台上的嵌合孔，用于夹持切割刀片的外周侧表面上的抓握表面，用于容纳第二超声换能器的第二超声波换能器容纳部分和限定的多个通孔 在第二超声波换能器容纳部和配合孔之间。