公开(公告)号：US08714711B2

公开(公告)日：2014-05-06

申请号：US13596634

申请日：2012-08-28

申请人： Shimpei Otaka ,  Takayuki Ono ,  Masao Furukawa ,  Jun Hinami ,  Takeshi Shibata ,  Ryo Shimamura ,  Takanori Enomoto ,  Tomohiro Takahashi ,  Masashi Ishikawa

发明人： Shimpei Otaka ,  Takayuki Ono ,  Masao Furukawa ,  Jun Hinami ,  Takeshi Shibata ,  Ryo Shimamura ,  Takanori Enomoto ,  Tomohiro Takahashi ,  Masashi Ishikawa

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC分类号： B41J2/14024 ,  B41J2/1623

摘要： A liquid recording head includes a protective layer having resistance to liquid and an adhesiveness improving film disposed on a second surface of a silicon substrate, opposite to a first surface. The first surface and the second surface have a plane direction (100). The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates with a liquid introduction port on a side of the second surface of the silicon substrate.

摘要翻译： 液体记录头包括具有耐液体的保护层和设置在硅基板的与第一表面相对的第二表面上的粘合性改进膜。 第一表面和第二表面具有平面方向（100）。 保护层设置在液体供给口的开口的周边区域。 液体喷射芯片用粘合剂粘合到头基板上，使得液体供给口与硅基板的第二表面侧的液体导入口连通。

公开(公告)号：US08197705B2

公开(公告)日：2012-06-12

申请号：US12203536

申请日：2008-09-03

申请人： Keisuke Kishimoto ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Kazuhiro Asai ,  Shimpei Otaka ,  Hiroto Komiyama

发明人： Keisuke Kishimoto ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Kazuhiro Asai ,  Shimpei Otaka ,  Hiroto Komiyama

IPC分类号： G01D15/00 ,  G11B5/127

CPC分类号： B41J2/1634 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629

摘要： A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an aperture being formed on one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from the aperture on the one surface, from the one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from the one surface through the aperture of the etching mask layer.

摘要翻译： 一种制造具有其中提供液体供应口的硅衬底的液体排出头的衬底的方法包括提供硅衬底，具有形成在硅衬底的一个表面上的孔的蚀刻掩模层，形成包括 通过用激光照射硅衬底，在硅衬底的内部形成非晶硅，在硅衬底的一个表面上形成凹部，该凹部具有从一个表面上的孔露出的部分的一部分的开口 并且通过在蚀刻掩模层的孔径上从一个表面形成凹部和区域的硅衬底上进行蚀刻来形成供给口。

公开(公告)号：US20100248156A1

公开(公告)日：2010-09-30

申请号：US12794679

申请日：2010-06-04

申请人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

发明人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

IPC分类号： G03F7/20

CPC分类号： C08F2/50 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  C08G59/3218 ,  C08G59/687 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515

摘要： An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

摘要翻译： 环氧树脂组合物，包括：由式（1）表示的环氧树脂（A）; 环氧当量为220以下，环氧树脂（A）的环氧基分子中环氧基数为2以上的环氧树脂（B）。 和光阳离子聚合引发剂（C），其中：环氧树脂（A）和（B）构成主要组分; 环氧树脂（A）的重量为40％以上，环氧树脂（B）的重量相对于环氧树脂（A）和（B）的总重量为30％以上：其中： R表示氢原子，甲基，乙基，丙基或叔丁基; 表示0以上且4以下的整数， m表示1以上3以下的整数。

公开(公告)号：US20100045739A1

公开(公告)日：2010-02-25

申请号：US12612659

申请日：2009-11-04

申请人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

发明人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

IPC分类号： B41J2/135

CPC分类号： C08F2/50 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  C08G59/3218 ,  C08G59/687 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515

摘要： An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

公开(公告)号：US20090314742A1

公开(公告)日：2009-12-24

申请号：US12484937

申请日：2009-06-15

申请人： Keisuke Kishimoto ,  Satoshi Ibe ,  Takuya Hatsui ,  Shimpei Otaka ,  Hiroto Komiyama ,  Hiroyuki Morimoto ,  Masahiko Kubota ,  Toshiyasu Sakai

发明人： Keisuke Kishimoto ,  Satoshi Ibe ,  Takuya Hatsui ,  Shimpei Otaka ,  Hiroto Komiyama ,  Hiroyuki Morimoto ,  Masahiko Kubota ,  Toshiyasu Sakai

IPC分类号： G01D15/18

CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639

摘要： A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.

摘要翻译： 一种处理衬底的方法包括制备在其第一表面侧上具有第一层的衬底，所述第一层具有能够抑制激光透射的材料，用来自与第一层相反的第二表面的激光来处理衬底 基板的表面朝向基板的第一表面，并且允许激光到达第一层以在基板中形成孔，并且通过该孔从第二表面进行基板的蚀刻。

公开(公告)号：US20090065481A1

公开(公告)日：2009-03-12

申请号：US12203536

申请日：2008-09-03

申请人： Keisuke Kishimoto ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Kazuhiro Asai ,  Shimpei Otaka ,  Hiroto Komiyama

发明人： Keisuke Kishimoto ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Kazuhiro Asai ,  Shimpei Otaka ,  Hiroto Komiyama

IPC分类号： B44C1/22

CPC分类号： B41J2/1634 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629

摘要： A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an opening being formed on a one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from said opening on said one surface, from said one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from said one surface through the opening of the etching mask layer.

摘要翻译： 一种制造具有其中提供液体供给口的硅基板的液体排出头的基板的方法包括：提供硅基板，在硅基板的一个表面上形成有开口的蚀刻掩模层，形成区域 在所述硅衬底的内部通过用激光照射所述硅衬底而形成非晶硅，形成在所述一个表面的所述一个表面上从所述一个表面上的所述开口露出的部分具有开口的凹部 基板朝向该区域，并且通过在通过蚀刻掩模层的开口从所述一个表面形成凹部和区域的硅基板上进行蚀刻来形成供给口。

公开(公告)号：US20090065472A1

公开(公告)日：2009-03-12

申请号：US12203612

申请日：2008-09-03

申请人： Kazuhiro Asai ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Shimpei Otaka ,  Hiroto Komiyama ,  Keisuke Kishimoto

发明人： Kazuhiro Asai ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Shimpei Otaka ,  Hiroto Komiyama ,  Keisuke Kishimoto

IPC分类号： G11B5/127

CPC分类号： B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645

摘要： To provide a manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.

摘要翻译： 为了提供一种制造方法，对于包括其中形成有液体供给口的硅基板的液体排出头基板，包括以下步骤：制备硅基板，其一面上具有开口的掩模层 已经形成，被存放; 在所述硅衬底中形成第一凹部，使得所述凹部从所述硅衬底的一个面向所述开口延伸到所述硅衬底的另一面; 通过使用掩模层经由第一凹部对基板进行湿法蚀刻来形成第二凹部; 并且在从第二凹部到另一面的方向上对硅衬底进行干蚀刻。

公开(公告)号：US07887162B2

公开(公告)日：2011-02-15

申请号：US12696779

申请日：2010-01-29

申请人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

发明人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

IPC分类号： C08F2/50 ,  B41J2/05

CPC分类号： C08F2/50 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  C08G59/3218 ,  C08G59/687 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515

摘要： An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

公开(公告)号：US20100134555A1

公开(公告)日：2010-06-03

申请号：US12696779

申请日：2010-01-29

申请人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

发明人： Shimpei Otaka ,  Kazunari Ishizuka ,  Isamu Horiuchi ,  Isao Imamura

IPC分类号： B41J2/015

CPC分类号： C08F2/50 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  C08G59/3218 ,  C08G59/687 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31515

摘要： An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

摘要翻译： 环氧树脂组合物，包括：由式（1）表示的环氧树脂（A）; 环氧当量为220以下，环氧树脂（A）的环氧基分子中环氧基数为2以上的环氧树脂（B）。 和光阳离子聚合引发剂（C），其中：环氧树脂（A）和（B）构成主要组分; 环氧树脂（A）的重量为40％以上，环氧树脂（B）的重量相对于环氧树脂（A）和（B）的总重量为30％以上：其中： R表示氢原子，甲基，乙基，丙基或叔丁基; n表示0以上且4以下的整数， m表示1以上3以下的整数。

公开(公告)号：US20080309719A1

公开(公告)日：2008-12-18

申请号：US12128327

申请日：2008-05-28

申请人： Kazunari Ishizuka ,  Shimpei Otaka ,  Isao Imamura

发明人： Kazunari Ishizuka ,  Shimpei Otaka ,  Isao Imamura

IPC分类号： B41J2/14

CPC分类号： B41J2/162 ,  B41J2/1433 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/164

摘要： A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged correspond to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin.

摘要翻译： 排液头包括排出口形成部件，该排出口形成部件形成有排出口，该排出口对应于产生能量以排出液体的能量产生元件，以及流路形成部件，用于形成用于向排出口供给墨水的流路。 排出口形成构件和流路形成构件中的至少一个由含有环氧树脂和具有比环氧树脂的氧当量高的酚醛树脂的组合物的固化材料制成。