Portable electronic device
    1.
    发明授权

    公开(公告)号:US11079795B2

    公开(公告)日:2021-08-03

    申请号:US16143483

    申请日:2018-09-27

    IPC分类号: G06F1/16

    摘要: A portable electronic device includes a first body, a second body, a pivot assembly, and a protective assembly. The pivot assembly is pivoted to the first body and the second body and includes a shaft. The first body pivots relative to the second body via the shaft. The protective assembly is slidably disposed at periphery of the first body and the second body and includes at least one guide structure and at least one sliding structure. When the first body moves relative to the second body from a lock position to an open position, the protective assembly drives the guide structure and the sliding structure to slide along the periphery of the first body and the second body and drive the guide structure to be coaxially arranged with the shaft to allow the protective assembly to rotate with the first body relative to the second body.

    PORTABLE ELECTRONIC DEVICE
    6.
    发明申请

    公开(公告)号:US20190101955A1

    公开(公告)日:2019-04-04

    申请号:US16143483

    申请日:2018-09-27

    IPC分类号: G06F1/16

    摘要: A portable electronic device includes a first body, a second body, a pivot assembly, and a protective assembly. The pivot assembly is pivoted to the first body and the second body and includes a shaft. The first body pivots relative to the second body via the shaft. The protective assembly is slidably disposed at periphery of the first body and the second body and includes at least one guide structure and at least one sliding structure. When the first body moves relative to the second body from a lock position to an open position, the protective assembly drives the guide structure and the sliding structure to slide along the periphery of the first body and the second body and drive the guide structure to be coaxially arranged with the shaft to allow the protective assembly to rotate with the first body relative to the second body.

    ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS
    7.
    发明申请
    ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS 审中-公开
    超声波接线带多个接合线

    公开(公告)号:US20140326778A1

    公开(公告)日:2014-11-06

    申请号:US13888189

    申请日:2013-05-06

    申请人: Shang-Che Lee

    发明人: Shang-Che Lee

    IPC分类号: H01L23/00 B23K20/10

    摘要: An ultrasonic wire bonding wedge with multiple bonding wire slots is provided. The wire bonding wedge includes a pillar fixing part for providing fixed connection to the bonding device. One end of the fixing part includes a wire bonding wedge nozzle, with feature that the tip of the nozzle including at least two bonding wire slots. The tip of nozzle of the wire bonding wedge includes at least two bonding wire slots, and is able to realize bonding operations between two or more bonding wires and the chips to improve bonding operation efficiency. When bonding operation is performed on a smaller bonding area, or two or more parallel bonding wires, the wire bonding wedge is able to perform a single bonding operation in a smaller bonding operation so as to reduce defective rate of the chips and ensure sufficient bonding strength of the bonding operation.

    摘要翻译: 提供具有多个接合线槽的超声波引线接合楔。 引线键合楔包括用于提供与接合装置的固定连接的柱固定部。 固定部分的一端包括引线键合楔形喷嘴,其特征在于喷嘴的尖端包括至少两个接合线槽。 引线接合楔的喷嘴的尖端包括至少两个接合线槽,并且能够实现两个或更多个接合线和芯片之间的接合操作,以提高接合操作效率。 当在较小的接合面积或两根或多根平行的接合线上进行接合操作时,引线接合楔可以在较小的接合操作中进行单次接合操作,以便减少切屑的缺陷率并确保足够的接合强度 的接合操作。