公开(公告)号：US07614341B1

公开(公告)日：2009-11-10

申请号：US11076422

申请日：2005-03-10

申请人： Deepak K. Pai ,  Scott P. Lichtenauer

发明人： Deepak K. Pai ,  Scott P. Lichtenauer

IPC分类号： B05C17/10

CPC分类号： H05K3/1233 ,  B41F15/46 ,  H05K3/3484 ,  H05K2203/0139

摘要： The present invention relates to a segmented squeegee for depositing a medium onto a surface, such as depositing solder paste onto a printed wiring board. The segmented squeegee may include a plurality of independent squeegee segments or elements, a support structure and a plurality of independent connections or linkages connecting the squeegee segments to the support structure. The segmented squeegee may be used in connection with a conventional stencil such that the independent linkages and the squeegee segments may be structured and arranged to maintain substantial contact between the stencil and the printed wiring board.

摘要翻译： 本发明涉及用于将介质沉积到表面上的分段刮板，例如将焊膏沉积到印刷线路板上。 分段刮板可以包括多个独立的刮板段或元件，支撑结构以及将刮板段连接到支撑结构的多个独立连接或连接。 分段刮板可以与常规模板结合使用，使得独立连杆和刮板段可被构造和布置成保持模板和印刷线路板之间的实质接触。