公开(公告)号：US20130181251A1

公开(公告)日：2013-07-18

申请号：US13822454

申请日：2011-09-26

Applicant: Sachio Higuchi ,  Takashi Tanaka ,  Mitunori Mizoguti ,  Tsuyoshi Inui ,  Atsuo Fukuda

Inventor： Sachio Higuchi ,  Takashi Tanaka ,  Mitunori Mizoguti ,  Tsuyoshi Inui ,  Atsuo Fukuda

IPC: H01L33/64

CPC classification number: H01L33/64 ,  H01L24/48 ,  H01L25/167 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.

Abstract translation: LED模块包括：具有设置在相对侧壁的外表面上的电极的封装和连接到电极并安装在封装上的发光元件; 具有铜金属的基底构件; 绝缘层，堆叠在所述基底构件的表面上并具有绝缘材料; 以及通过焊接连接到电极并形成在绝缘层的表面上的导电布线图案。 绝缘层具有通过去除封装所在部分的一部分而形成的通孔，以及通过在封装的后表面与基底构件之间焊接形成的通孔， 孔之间。

公开(公告)号：US08866183B2

公开(公告)日：2014-10-21

申请号：US13822454

申请日：2011-09-26

Applicant: Sachio Higuchi ,  Takashi Tanaka ,  Mitunori Mizoguti ,  Tsuyoshi Inui ,  Atsuo Fukuda

Inventor： Sachio Higuchi ,  Takashi Tanaka ,  Mitunori Mizoguti ,  Tsuyoshi Inui ,  Atsuo Fukuda

IPC: H01L33/00 ,  H01L33/64 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/64 ,  H01L24/48 ,  H01L25/167 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.

Abstract translation: LED模块包括：具有设置在相对侧壁的外表面上的电极的封装和连接到电极并安装在封装上的发光元件; 具有铜金属的基底构件; 绝缘层，堆叠在所述基底构件的表面上并具有绝缘材料; 以及通过焊接连接到电极并形成在绝缘层的表面上的导电布线图案。 所述绝缘层具有通过去除所述封装所位于的部分的一部分而形成的通孔，以及通过在所述封装的背面与所述基部构件之间焊接而形成的通孔， 孔之间。