公开(公告)号：US20210129535A1

公开(公告)日：2021-05-06

申请号：US16472783

申请日：2017-12-05

Applicant: SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION

Inventor： Daisuke YAMADA ,  Motoki TAKABE ,  Yasuyiikl MATSUMOTO ,  Yoichi NAGANUMA ,  Eiju HIRAI

IPC: B41J2/14 ,  B41J2/16 ,  B81B3/00 ,  B81B7/00 ,  B81C3/00

Abstract: Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.