摘要:
A tray for storage and transportation of multiple pin grid array (PGA) and K6 integrated circuit components, each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that interfit between adjacent integrated circuit components. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to position the terminal pin in precise alignment with the tray. The rib axes are intersecting and oblique to the general tray orientation.
摘要:
A tray for storage and transportation of multiple staggered integrated circuit components, each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that interfit between adjacent integrated circuit components. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to position the terminal pin in precise alignment with the tray. The rib axes are intersecting and oblique to the general tray orientation. Positioning fingers provide initial positioning to align the terminal pins and ribs. Pedestals define a support plane and support the integrated circuit with the terminal pins spaced from a base plate.
摘要:
A thermal shunt apparatus directs heat flux transmitted through electrical signal leads from a focal plane array (FPA) to a relatively isothermal top surface of a TE cooler. The FPA mounts with a first thermally conductive attachment to a thermal spreader plate that is highly thermally conductive. The thermal spreader plate is mounted to the top surface of the TE cooler by a second thermally conductive attachment. The combination of the relatively isothermal surfaces, the FPA thermal spreader and the TE cooler top plate, separated by the thermally conductive interface, maintains a relatively constant temperature difference between the electrical leads connected between the thermal shunt and the FPA edge. The constant temperature difference provides for constant heat flux between these points and a constant temperature gradient across the surface of the FPA.
摘要:
A tray for storage and transportation of multiple pin grid array (PGA) integrated circuit components each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that engage the integrated circuit component. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to support the bottom of the component.
摘要:
A system for storing integrated circuits in a stacked relationship comprising integrated circuit storage trays and spacer trays. Each integrated circuit storage tray has a storage pocket area for containing an integrated circuit. When portions of the integrated circuit protrude beyond the overall profile of the storage tray, a spacer tray can be interposed between adjacent storage trays. The spacer tray elevates an adjacent storage tray to clear the protruding portions of the integrated circuit. The spacer tray also includes tabs or other structures for overlying portions of each integrated circuit in an adjacent storage tray thereby to retain the integrated circuits within the storage tray.
摘要:
A carrier adapted for diverse electrical and electronic components to facilitate shipping, handling and testing of these components. The carrier comprises a conductive frame and an electrically isolating insert. The insert electrically isolates each terminal lead of the component from other terminal leads as well as from all conductive material. The conductive frame abuts additional surfaces of the insulative insert, as well as forming most external surfaces of the carrier structure, thereby dissipating any electrostatic charges that can accumulate. The electrically isolating insert comprises a moldable plastic material having a limited amount of conductive filler such that the surface resistivity of the insert is at least 10.sup.10 ohms.
摘要:
A carrier system for facilitating the production of electrical assemblies with electrical components including a component carrier and a fixture for facilitating component insertion and removal with the carrier. The carrier comprises an open rectangular peripheral skirt with a transverse support plate for engaging a component housing. Spaced flexible bowed retaining arms extend across the peripheral skirt. Each arm has a clip extension for securing the component housing in the carrier. Central operating structures on each retaining arm facilitate movement between first and second positions. Slide tabs on each arm coact with the peripheral skirt to prevent rotation of the retaining arms during motion. Operating tabs are spaced at fixed positions relative to the peripheral skirt. Supporting plates interconnect each tab to a respective operating arm that is positioned within the peripheral skirt as a function of component housing size. The system also includes a fixture that deflects the operating tabs as a carrier moves through the fixture.
摘要:
A carrier adapted for diverse electrical and electronic components to facilitate shipping, handling and testing of these components. The carrier comprises a conductive frame and an insulative insert. The insulative insert electrically isolates each terminal lead of the component from other terminal leads as well as from all conductive material. The conductive frame abuts additional surfaces of the insulative insert, as well as forming most external surfaces of the carrier structure, thereby dissipating any electrostatic charges that can accumulate.
摘要:
A tray for ball grid array integrated circuits includes a storage pocket with a transverse structure. The transverse structure carries a plurality of columnar structures at spaced positions on and extending normally from the surface of the transverse structure. Each columnar support structure includes parallel columns that terminate in coplanar free ends that engage the terminal surface of one ball grid array integrated circuit to support it in a terminals down position within the storage pocket.
摘要:
A carrier for a flatpack integrated circuit component. The carrier includes a square frame formed of a conductive plastic and a series of electrically isolating comb inserts for supporting terminals from a flat pack integrated circuit component. Elongated slots at each of the corners of the frame support linearly reciprocal slide tabs that move between first and second positions. In the first position a finger from each slide tab overlies the frame member; in a second position the finger overlies either a portion of the component housing or a portion of the comb inserts and at least one terminal from the integrated circuit in the comb at each corner thereby to retain the component in the carrier.