公开(公告)号：US06713862B2

公开(公告)日：2004-03-30

申请号：US10199418

申请日：2002-07-19

申请人： Ponnuswamy Palanisamy ,  Attiganal Narayanaswamysreeram ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  John Connolly ,  Ramon Ubaldo Martinelli ,  Ashok Narayan Prabhu ,  Mark Stuart Hammond ,  Joseph Mazzochette

发明人： Ponnuswamy Palanisamy ,  Attiganal Narayanaswamysreeram ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  John Connolly ,  Ramon Ubaldo Martinelli ,  Ashok Narayan Prabhu ,  Mark Stuart Hammond ,  Joseph Mazzochette

IPC分类号： H01L2334

CPC分类号： H01S5/02248 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02484 ,  H01L2924/00014

摘要： Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

摘要翻译： 包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。 各种电子部件以及附加的温度控制装置可以连接到电路板和金属支撑基板，以控制或调节部件的操作温度。 集成包装可以用盖子气密密封。

公开(公告)号：US06455930B1

公开(公告)日：2002-09-24

申请号：US09664599

申请日：2000-09-18

申请人： Ponnuswamy Palanisamy ,  Attiganal Narayanaswamy Sreeram ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  John Connolly ,  Ramon Ubaldo Martinelli ,  Ashok Narayan Prabhu ,  Mark Stuart Hammond

发明人： Ponnuswamy Palanisamy ,  Attiganal Narayanaswamy Sreeram ,  Ellen Schwartz Tormey ,  Barry Jay Thaler ,  John Connolly ,  Ramon Ubaldo Martinelli ,  Ashok Narayan Prabhu ,  Mark Stuart Hammond

IPC分类号： H01L2334

CPC分类号： H01S5/02248 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02484 ,  H01L2924/00014

摘要： Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

摘要翻译： 包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。 各种电子部件以及附加的温度控制装置可以连接到电路板和金属支撑基板，以控制或调节部件的操作温度。 集成包装可以用盖子气密密封。