ELECTRONIC UNIT HAVING A HOUSING IN WHICH HEAT GENERATING COMPONENTS ARE DISPOSED
    1.
    发明申请
    ELECTRONIC UNIT HAVING A HOUSING IN WHICH HEAT GENERATING COMPONENTS ARE DISPOSED 审中-公开
    具有发热组件的壳体的电子单元处理

    公开(公告)号:US20130301214A1

    公开(公告)日:2013-11-14

    申请号:US13992066

    申请日:2011-12-05

    IPC分类号: G06F1/20 H05K7/20

    CPC分类号: G06F1/20 H05K7/2039

    摘要: An electronic unit having a housing including a heat generating first component, a heat generating second component and a cooling system disposed in the housing, wherein during operation of the unit, the first and second components are cooled by the cooling system, and the first component connects to the second component via a heat-conducting connection such that a lower temperature of the first component and a higher temperature of the second component converge.

    摘要翻译: 一种具有壳体的电子单元,所述壳体包括发热第一部件,发热第二部件和布置在所述壳体中的冷却系统,其中在所述单元运行期间,所述第一和第二部件被所述冷却系统冷却,并且所述第一部件 通过导热连接连接到第二部件,使得第一部件的较低温度和第二部件的较高温度会聚。