Joining Method For Joining Components
    3.
    发明申请
    Joining Method For Joining Components 有权
    加入组件的联接方法

    公开(公告)号:US20100038409A1

    公开(公告)日:2010-02-18

    申请号:US12112870

    申请日:2008-04-30

    CPC classification number: B23K1/0006

    Abstract: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

    Abstract translation: 提供一种用于连接部件的方法,特别是在航空航天领域,其中第一部件连接到第二部件,其包括以下步骤:在第一和第二部件之间布置至少一种纳米或微结构材料,引发放热反应 用于将两个部件彼此连接的纳米或微结构材料。

    Aluminum-based solder material
    5.
    发明授权
    Aluminum-based solder material 失效
    铝基焊料

    公开(公告)号:US5618357A

    公开(公告)日:1997-04-08

    申请号:US493672

    申请日:1995-06-22

    CPC classification number: B23K35/286

    Abstract: A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that especially contains about 10 to 50 wt. % of germanium, about 1 to 12 wt. % of silicon, about 0.1 to 3 wt. % of magnesium, and about 0.1 to 3 wt. % of indium. The solder material is useful at soldering temperatures in the range from 424.degree. to about 600.degree. C., and is therefore especially suitable for the fluxless hard soldering of components made of precipitation-hardened high-strength aluminum-based materials.

    Abstract translation: 特别适用于铝基部件的无助焊硬焊接的焊料材料由铝基合金组成,其特别地包含约10至50wt。 约1〜12wt。 硅的百分比,约0.1至3wt。 %的镁和约0.1至3wt。 %的铟。 焊料材料在424〜600℃的焊接温度下是有用的,因此特别适用于由沉淀硬化的高强度铝基材料制成的部件的无焊剂硬焊接。

    Joining method for joining components
    6.
    发明授权
    Joining method for joining components 有权
    加入组件的联接方法

    公开(公告)号:US07975902B2

    公开(公告)日:2011-07-12

    申请号:US12112870

    申请日:2008-04-30

    CPC classification number: B23K1/0006

    Abstract: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

    Abstract translation: 提供一种用于连接部件的方法,特别是在航空航天领域,其中第一部件连接到第二部件,其包括以下步骤:在第一和第二部件之间布置至少一种纳米或微结构材料,引发放热反应 用于将两个部件彼此连接的纳米或微结构材料。

    Method of coating a substrate
    7.
    发明申请
    Method of coating a substrate 有权
    涂布基材的方法

    公开(公告)号:US20080145555A1

    公开(公告)日:2008-06-19

    申请号:US11906278

    申请日:2007-10-01

    CPC classification number: B05D1/08 B05D7/02 B05D7/52

    Abstract: The present invention provides a method for coating a substrate, in particular a fiber reinforced plastic component, a protective layer being applied, with preference by means of thermal spraying, to a non-cured resin film applied to a release film, and subsequently, after removal of the release film, the resin film being applied to the substrate and cured.

    Abstract translation: 本发明提供了一种通过热喷涂优选地将基材,特别是纤维增强塑料组分,保护层涂覆到施加到脱模膜的未固化树脂膜上,随后在 去除脱模膜,将树脂膜施加到基材上并固化。

Patent Agency Ranking