公开(公告)号：US07488679B2

公开(公告)日：2009-02-10

申请号：US11461137

申请日：2006-07-31

申请人： Theodorus Eduardus Standaert ,  Pegeen M. Davis ,  John Anthony Fitzsimmons ,  Stephen Edward Greco ,  Tze-Man Ko ,  Naftali Eliahu Lustig ,  Lee Matthew Nicholson ,  Sujatha Sankaran

发明人： Theodorus Eduardus Standaert ,  Pegeen M. Davis ,  John Anthony Fitzsimmons ,  Stephen Edward Greco ,  Tze-Man Ko ,  Naftali Eliahu Lustig ,  Lee Matthew Nicholson ,  Sujatha Sankaran

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H01L21/76808 ,  H01L21/76805 ,  H01L21/76814 ,  H01L21/76846 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming an interconnect structure in an inter-layer dielectric (ILD) material, the method include the steps of creating one or more via openings in the ILD material; forming a first liner covering at least one of the one or more via openings; creating one or more trench openings on top of at least one of the one or more via openings covered by the first liner; and forming a second liner covering the trenching openings and at least part of the first liner. An interconnect structure formed by the method is also provided.

摘要翻译： 一种在层间电介质（ILD）材料中形成互连结构的方法，所述方法包括以下步骤：在ILD材料中形成一个或多个通路孔; 形成覆盖所述一个或多个通孔开口中的至少一个的第一衬垫; 在由所述第一衬垫覆盖的所述一个或多个通孔中的至少一个的顶部上形成一个或多个沟槽开口; 以及形成覆盖所述下料开口和所述第一衬里的至少一部分的第二衬里。 还提供了通过该方法形成的互连结构。

公开(公告)号：US20080026568A1

公开(公告)日：2008-01-31

申请号：US11461137

申请日：2006-07-31

申请人： Theodorus Eduardus Standaert ,  Pegeen M. Davis ,  John Anthony Fitzsimmons ,  Stephen Edward Greco ,  Tze-Man Ko ,  Naftali Eliahu Lustig ,  Lee Matthew Nicholson ,  Sujatha Sankaran

发明人： Theodorus Eduardus Standaert ,  Pegeen M. Davis ,  John Anthony Fitzsimmons ,  Stephen Edward Greco ,  Tze-Man Ko ,  Naftali Eliahu Lustig ,  Lee Matthew Nicholson ,  Sujatha Sankaran

IPC分类号： H01L21/4763

CPC分类号： H01L21/76808 ,  H01L21/76805 ,  H01L21/76814 ,  H01L21/76846 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming an interconnect structure in an inter-layer dielectric (ILD) material, the method include the steps of creating one or more via openings in the ILD material; forming a first liner covering at least one of the one or more via openings; creating one or more trench openings on top of at least one of the one or more via openings covered by the first liner; and forming a second liner covering the trenching openings and at least part of the first liner. An interconnect structure formed by the method is also provided.

摘要翻译： 一种在层间电介质（ILD）材料中形成互连结构的方法，所述方法包括以下步骤：在ILD材料中形成一个或多个通路孔; 形成覆盖所述一个或多个通孔开口中的至少一个的第一衬垫; 在由所述第一衬垫覆盖的所述一个或多个通孔中的至少一个的顶部上形成一个或多个沟槽开口; 以及形成覆盖所述下料开口和所述第一衬里的至少一部分的第二衬里。 还提供了通过该方法形成的互连结构。